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    Home»Expert Views»Xiang Qidi of BOE Hc Semitek: New Future of LED Display Chip
    Expert Views

    Xiang Qidi of BOE Hc Semitek: New Future of LED Display Chip

    Doris MiniMicroLEDBy Doris MiniMicroLEDNovember 6, 2024Updated:November 7, 2024No Comments5 Mins Read16 Views
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    Xiang Qidi of BOE Hc Semitek: New Future of LED Display Chip
    BOE Hc Semitek Xiang Qidi
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    On November 6, 2024, at the Shenzhen International New Display Industry Technology Summit 2024, Mr. Xiang Qidi, Head of the Display Business Unit at BOE Huacan Optoelectronics Co., Ltd., delivered a speech titled “New Future of LED Display Chip”. During the presentation, he shared the latest developments in the LED display chip industry amidst current technological transformations and provided an in-depth analysis of the future applications of Mini LED and Micro LED technologies in the display sector. As an industry expert, Mr. Xiang offered valuable insights into the future potential of LED display technology in improving display performance, reducing costs, and enabling mass production.

    Table of Contents

    Toggle
    • Mini LED and Micro LED: The Future of Display Technology
    • Advancements in Packaging Technology
    • Industry Challenges and Development Prospects
    • Looking to the Future
    • Conclusion

    Mini LED and Micro LED: The Future of Display Technology

    Mr. Xiang pointed out that, in recent years, the demand for small-pitch displays and high-resolution displays has been growing rapidly, driving Mini LED and Micro LED to become mainstream technologies in the display industry. These technologies not only offer higher brightness, contrast, and color accuracy, but also enable high-performance displays in smaller spaces, meeting the increasingly diverse market demands. As both Mini LED and Micro LED technologies continue to mature, they are expected to drive a new wave of growth in the entire display industry in the coming years.

    Advancements in Packaging Technology

    When discussing packaging technologies, Mr. Xiang highlighted the challenges posed by traditional SMD (Surface-Mounted Device) packaging in the small-pitch and high-brightness display fields. As an emerging solution, COB (Chip-on-Board) packaging is gradually becoming the industry standard. The COB technology not only reduces the size of the backlight modules but also improves the consistency and brightness uniformity of the display, making it the preferred choice for high-end display products.

    Industry Challenges and Development Prospects

    Despite the many opportunities brought by Mini LED and Micro LED technologies, Mr. Xiang also reminded the audience that there are still challenges associated with their development. The first of these challenges is the issue of epitaxial consistency. As technology advances, the demand for epitaxial materials becomes more stringent, posing higher requirements for chip manufacturers. To meet the market’s demand for high-quality LED chips, the industry must intensify research and development efforts to enhance epitaxial growth technologies and production consistency.

    Secondly, Mr. Xiang mentioned that breakthroughs in micro-level control technologies are crucial for improving display quality. To ensure consistency and stability in display performance, chip manufacturers must make greater strides in process control, particularly in the precision manufacturing field at the micron level.

    Finally, Mr. Xiang discussed the gradual improvement of quality transfer technology. In the LED display chip industry, ensuring the consistency of chip quality during mass production has become one of the key factors determining a product’s competitiveness. As quality transfer technology matures, the number of defective products during production will significantly decrease, further enhancing product reliability.

    Looking to the Future

    Looking ahead, Mr. Xiang emphasized that as Mini LED and Micro LED technologies continue to advance, their applications will become even more widespread in consumer electronics, large-size displays, and professional displays. In particular, these technologies will play a pivotal role in the development of ultra-large screen televisions, virtual reality (VR), augmented reality (AR), and automotive displays, driving a new revolution in the display industry.

    He also stressed that BOE Huacan Optoelectronics Co., Ltd., as a leading enterprise in the industry, is committed to driving innovation and development in LED display chips. Moving forward, the company will continue to increase its investments in Mini LED and Micro LED technologies and work with upstream and downstream industry partners to promote the large-scale production and widespread adoption of LED display technology, with the goal of providing global customers with high-quality, innovative display solutions.

    Conclusion

    Mr. Xiang’s presentation not only provided attendees with a deep understanding of the future trends in LED display chip technology but also offered valuable insights for the industry in terms of technological innovation and market expansion. As technology continues to evolve, the future of the LED display chip industry will be full of endless possibilities, with Mini LED and Micro LED technologies undoubtedly at the forefront of this future.


    Disclaimer: The views and opinions expressed in this article are those of the author and do not necessarily reflect the official policy or position of MiniMicroLED Insights. The content of this article is based on original research and analysis, and is intended for informational purposes only. The information in this article should not be construed as professional advice. While every effort has been made to ensure the accuracy and reliability of the information provided, no representations or warranties, express or implied, are made regarding the completeness, accuracy, or timeliness of the content. Any reliance placed on the information is strictly at the reader’s own risk. To the fullest extent permitted by law, MiniMicroLED Insights disclaims all liability for any direct, indirect, incidental, consequential, or punitive damages arising from the use of, or reliance on, the information contained in this article.

    Copyright Notice: This article is an original creation by MiniMicroLED Insights, and all rights are reserved. Should you wish to quote this content, prior written consent from the author is required, and proper attribution must be provided. Where applicable and to the extent permitted by applicable law, this content is reproduced for educational and informational purposes under the fair use doctrine. If you believe any content on this site infringes upon your intellectual property rights, or if you are the copyright owner and believe we have not credited you correctly, please contact us at minimicroled.business@gmail.com. We will investigate and take corrective action, including removing or properly crediting the content if necessary.

    Content authored by: MiniMicroLED Insights (Doris).

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