Introduction
Recently, WG Tech announced that the first equipment line for its Tongge Micro project, with an annual production capacity of 100,000 square meters of chip-level packaging substrates, has begun installation, moving closer to official mass production.
Equipment Installation Details
The equipment being installed is a complete PVD coating line, consisting of multiple high-end machines developed in collaboration with equipment suppliers. Once assembled, the line will measure over 40 meters in length. The next step involves the Tongge Micro team at the Tianmen base conducting assembly and debugging of the coating line in preparation for the arrival of additional equipment.
Project Overview
The Tongge Micro project, located in Tianmen City, Hubei Province, has a total investment of approximately $1.216 billion, with phase one involving an investment of 500 million yuan. The new facility spans 69,120 square meters and is designed to establish an automated production line for glass-based chip-level packaging substrates, achieving significant economies of scale in semiconductor advanced packaging substrate capacity.
Technological Innovations
The glass-based chip-level packaging substrates will primarily utilize the company’s proprietary TGV (Through Glass Via) technology, which is applicable in Mini/Micro LED direct display, advanced semiconductor packaging substrates, and other precision devices. According to WG Tech’s 2023 annual report, the project is expected to officially commence mass production in the second half of this year.
Focus and Capabilities
As a wholly-owned subsidiary of WG Tech, Tongge Micro is centered on TGV technology, leveraging advanced processes and material development capabilities including glass thinning, double-sided multilayer copper plating, insulation materials, and large-diameter vias. The company aims to focus on the mass production applications of glass substrates in semiconductor advanced packaging (Chiplet/CPO optoelectronic co-packaging), 6G communication RF antennas, and next-generation semiconductor displays.
Validation and Market Readiness
Several projects in the glass-based semiconductor advanced packaging substrate domain have already received validation from a well-known end customer, demonstrating their feasibility for mass production. In terms of next-generation semiconductor displays, WG Tech has collaborated with a prominent company to launch the world’s first glass-based TGV Micro LED display, which is currently transitioning into mass production and application phases.
Strategic Initiatives
It’s noteworthy that WG Tech has consistently pursued collaborations and strategic investments regarding new products, including Mini/Micro LED glass-based circuit boards.
- In March 2024, WG Tech increased its investment in its wholly-owned subsidiary Tongge Micro by 180 million yuan to expedite the 1 million square meter glass-based chip-level packaging substrate project.
- In February 2024, WG Tech acquired 70% of Tongge Micro’s shares from Hubei Tianmen High-tech Investment.
- In December 2023, WG Tech established a wholly-owned subsidiary, Jiangxi Wodejia Optoelectronics Co., Ltd., focused on the manufacturing of optoelectronic devices, electronic components, optical glass, and specialized electronic materials.
- In December 2023, WG Tech signed a strategic cooperation agreement with Tianma to develop and apply Mini LED COG solutions (including but not limited to automotive applications).
- In October 2023, WG Tech and Lehman Optoelectronics jointly launched the world’s first PM-driven glass-based Micro LED ultra-high-definition home giant screen product.
Disclaimer: The views and opinions expressed in this article are those of the original authors and do not necessarily reflect the official policy or position of MiniMicroLED Insights . While we strive to ensure the accuracy and reliability of the information provided, the content on this website may include translations, re-edited versions of second-hand information, or information derived from unverifiable sources. MiniMicroLED Insights makes no representations or warranties, express or implied, regarding the completeness, accuracy, or timeliness of such content. The information in this article is for informational purposes only and should not be construed as professional advice. Any reliance you place on such information is strictly at your own risk. To the fullest extent permitted by law, MiniMicroLED Insights disclaims all liability for any direct, indirect, incidental, consequential, or punitive damages arising out of your use of, or reliance on, the information contained in this article.
Copyright Notice: This article may include translated and re-edited content derived from various online sources, including websites and social media platforms. While we strive to credit the original authors and sources to the best of our ability, we may not always be able to verify the original source of the content. All rights to the original content remain with the original author or source publication. Where applicable, this content is reproduced for educational and informational purposes under the fair use doctrine. If you believe any content on this site infringes upon your intellectual property rights, or if you are the copyright owner and believe we have not credited you correctly, please contact us at minimicroled.business@gmail.com. We will investigate and take corrective action, including removing or properly crediting the content if necessary.
Content sourced and adapted by MiniMicroLED Insights (Doris).