Wafer — Raw Material and Production Platform
A wafer is the fundamental material in semiconductor manufacturing. It is typically made from high-purity silicon or other semiconductor materials and is cut into thin, round slices, usually ranging from a few hundred microns to a few millimeters in thickness. The surface of the wafer is precisely treated to ensure it is smooth and possesses an excellent crystal structure, making it suitable for the fabrication of electronic devices. One can think of the wafer as the paper used to create a book—it is not the final product, but rather the base upon which all subsequent processes are built.
Die — A Single Circuit Unit after Cutting
A die is the individual circuit unit that is formed on the wafer through processes such as photolithography, doping, and etching. After the wafer undergoes these semiconductor processes, it forms numerous integrated circuit structures. Each independent unit is a die. A die is cut from the wafer, and it is a complete electronic component with a distinct function, though it has not yet been packaged. Think of the die as a single article in a book: it is carved from the “whole book” (wafer), with its independent content and functionality but still incomplete. Dies are typically rectangular or square, with the size and shape determined by product design, functional requirements, and manufacturing processes. The quality of the die directly impacts the quality of the chip, so stringent testing and screening are required during production. For example, KGD (Known Good Die) must meet functional and reliability standards.
Chip — Final Product after Packaging
After cutting and testing the die, it is encapsulated to become a chip. The packaging provides physical protection for the die and connects the chip to external circuits via pins, pads, and other connectors. A chip is the final product intended for the market and end users. Only after packaging does the chip acquire its electrical functionality and can be used as part of an integrated circuit in various electronic devices. This is similar to a printed and bound book: the individual “articles” (dies) are integrated into a complete “book” (chip), with a “cover and table of contents” (the packaging), ready for “readers” (systems) to use.
The Relationship Between Wafer, Die, and Chip
The wafer serves as the raw material for production, and through precision processing, it yields multiple dies. Each die is an independent unit cut from the wafer, capable of performing specific functions. These dies typically undergo rigorous testing to ensure they are functional (KGD dies) and meet electrical and reliability requirements. Finally, the chip is the encapsulated die, which serves as the completed product with external interfaces, ready to connect with and work in electronic systems.
The relationship between the three can be visualized as a step-by-step manufacturing process: from the raw material (wafer) to the cutting of individual units (dies), and finally to the packaging into the finished product (chip). Each step is crucial and determines the quality and functionality of the final chip.

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