On June 20th at 10:00 AM, Unilumin Group held a grand event to launch its new Mini/Micro LED product range. The conference highlighted Micro LED as the next major revolution in display technology, expected to be crucial over the next decade. The market is eagerly anticipating this growth. During the event, Huang Xiongbiao, Product Director of Unilumin Group’s New Display Technology Research Institute, presented the company’s latest breakthroughs in COB LED micro-spacing. They shared insights into their ongoing R&D achievements, heralding a new era of visual innovation.
Unilumin’s Mini/Micro LED Platform: The Future of Display
Unilumin Mini&Micro Research Institute focuses on advancing Mini/Micro LED technology, characterized by self-luminescence, high efficiency, high integration, and high stability. These displays offer superior image quality and energy efficiency, positioning them as the future standard for markets like home theaters and virtual production, particularly for indoor scenarios ranging from P0.4 to P1.8. According to TrendForce Consulting, the global Micro LED market is projected to reach $3.8 billion by 2025, with a staggering compound annual growth rate of 258%.
The Journey of LED Direct Display Development
Since the inception of the micro-spacing project in 2012, Unilumin has continuously innovated in Mini/Micro LED technology. With a strong R&D team and the world’s largest LED display manufacturing base, the company has achieved leading structural design, advanced manufacturing processes, and robust production capabilities.
2023: All-scenario mass production of COB products, with MIP and COG products also entering production.
2016: Integrated industry resources and initiated special research.
2018: Achieved mass production of COB 0.9.
2020: Developed “surface blackening technology” and achieved mass production of COB 0.7.
2022: Mass production of UMicro 0.4, with a production capacity of 2,000㎡ per month.
Comprehensive Application Coverage of Mini/Micro LED
Unilumin Group’s Mini/Micro LED products now provide a wide range of solutions across various applications. increased by 50%, successfully seizing the industry’s “technology innovation” high point.
Technological Advancements in Chip, Substrate, Packaging, Drive, and System
Full Process Support
Unilumin’s latest COB LED micro-spacing technology has made significant breakthroughs in the five key processes: chip, substrate, packaging, drive, and system. The product achieves high contrast, enhanced protection, superior color reproduction, a 180° color consistency, and significant energy savings. Performance has increased by 50%, positioning Unilumin at the forefront of technology innovation in the industry.
Unilumin offers a complete product range, including a full flip-chip RGB Micro chip, advanced COB packaging technology, and a self-developed die-bonding mixed programming algorithm.
Chip Technology
All products in the series use the “full flip RGB Micro-level chip + COB packaging technology,” effectively eliminating failures caused by solder wire factors and reducing risks associated with metal migration. The absence of exposed SMD solder pads cuts the failure rate by 50%. Additionally, Unilumin’s proprietary die-bonding mixed coding algorithm enhances die-bonding efficiency while ensuring consistent product uniformity.
Substrate Innovation
The HDI M-SAP process enhances solder pad size accuracy and improves the chip die-bonding process window. Additional treatments include:
- Anti-moiré and anti-touch optical treatments
- Enhanced softness optical processing
- Anti-glare and enhanced contrast optical treatments
Advanced Packaging Techniques
Utilizing EBL+ multi-layer optical processing technology (an exclusive Unilumin patent), the product minimizes moiré, reduces reflection, and ensures no visible traces when touched. The contrast ratio reaches 30,000:1, delivering an exceptionally pure black. Moreover, Unilumin’s unique molding design solves the viewing angle problem.
EDL+ Drive Technology
Powered by EDL+ drive technology, Unilumin’s products support programmable current and high-precision 3ns low-gray correction, providing finely detailed low-gray images. The minimum starting gray brightness supports the 0.0X nit level, achieving higher dynamic contrast.
Self-Adaptive System
All products are compatible with Unilumin’s proprietary UOS system. With this integration, 3D-LUT color gamut calibration technology ensures a cinematic-grade wide color gamut conversion. Full grayscale correction and HDR support deliver high color reproduction and fine display quality.
Two Core Innovations: Massive Transfer & Full Automation Repair
Due to the smaller chip size of Mini/Micro LEDs, efficiently transferring a large number of LED beads to the circuit board is crucial for cost management. Unilumin has been focused on enhancing massive transfer efficiency, with a die-bonding efficiency UPH of 30K, a die-bonding yield of 99.999%, and an overall product yield of 98%.
Leveraging a global sales and service network in over 160 countries/regions with more than 4,000 locations, Unilumin has overcome the previous challenge of difficult repairs for COB products. Now, repairs can be completed in as little as 48 hours.
Fast Repairs and Delivery in 48 Hours
Unilumin’s Mini/Micro LED products and accompanying solutions cater to smart cities, smart meetings, commercial displays, sports venues, industrial control centers, XR virtual production, naked-eye 3D, and more. These technologies serve various industries, including education, security, energy, and transportation.
With robust R&D and intelligent manufacturing capabilities, Unilumin’s Mini/Micro COB capacity is steadily increasing. It is now the only company in the industry with a comprehensive process flow, full product range, wide application coverage, and complete production capabilities.
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