As the electronics industry continues to advance towards miniaturization, the precision of solder paste printing has become a central focus in the manufacturing process. This evolution requires not only sophisticated technology but also a deep understanding of the performance of ultra-fine solder pastes.
Understanding Solder Paste Powder Sizes
Solder paste is categorized by its powder size, with the most common types in the industry being T3, T4, T5, and T6. Each powder size has unique characteristics that affect printing performance, reflow behavior, and overall assembly performance.
Ultra-fine solder paste refers to paste with powder sizes of T5 or below. The table below shows the relative sizes of solder pastes from T3 to T10.
Exploring Ultra-Fine Solder Paste Applications: Micro LED / Mini LED
In production and PCB assembly, ultra-fine soldering involves the printing of solder paste with diameters smaller than one millimeter, or even smaller than one-tenth of a millimeter. This is achieved using advanced printing technologies that can precisely dispense and reflow the required small amounts of solder paste.

Due to the small size of the packages, component placement in these applications is equally precise, typically requiring automated equipment to assist. This precision is critical, especially when dealing with components such as 01005s (0.4mm x 0.2mm) or 008004s (0.2mm x 0.1mm), where virtually no margin for error exists.
Both MiniLED and MicroLED technologies involve assembling miniature LEDs onto substrates for display applications, demanding high precision and consistency.
MiniLED may be as small as 150 x 100 μm, necessitating the use of T6 solder paste. MicroLED, an emerging technology, can be as small as 50 x 50 μm and requires T7 or finer solder paste for precise and reliable soldering.
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