In August, the progress of Micro LED industrialization has been accelerating.
According to the official of KOALA URAN Technology, the company has successfully shipped the first domestically developed glass-based Micro LED wafer inspection equipment. In recent days, HYMSON, a laser intelligent equipment manufacturer, also announced the successful shipment of its first Micro LED pilot production line. Additionally, AUO, a major Micro LED panel manufacturer, reported the mass production and shipment of large-sized Micro LED TVs, now available for purchase in the market.
KOALA URAN: First Domestic Glass-based Micro LED Wafer Inspection Equipment Shipped
According to KOALA URAN’s official WeChat account, the company has successfully shipped the first domestically developed glass-based Micro LED wafer inspection equipment. KOALA URAN now has the capability for mass production of Micro LED wafer inspection equipment.
The glass-based Micro LED wafer inspection equipment by KOALA URAN integrates advanced international technology with its proprietary algorithms, offering high precision, stability, and efficiency. The equipment features an adjustable magnification optical system with 20X magnification precision reaching 0.16μm. Coupled with the company’s self-developed “active learning” AI algorithm, it can not only accurately identify visual defects but also classify them precisely. For offset measurement, KOALA URAN eliminates system errors caused by movement and distortion through calibration and coordinate system transformation, ensuring high accuracy in offset measurement, with an error margin controlled within ±0.5μm under standard test conditions.
Moreover, all core technologies of this equipment are independently developed by KOALA URAN, significantly improving cost control efficiency and ensuring that customers enjoy a more cost-effective product experience.
The official information reveals that KOALA URAN’s intelligent inspection product line focuses on providing comprehensive inspection solutions for semiconductor manufacturing and packaging testing. The team possesses top-notch automation design capabilities, highly integrated systems, and industry-leading AI algorithm technology, providing intelligent inspection equipment to several domestic semiconductor companies, thereby significantly improving product yield and production efficiency. The equipment includes but is not limited to COW/COT/COC inspection equipment, LED bracket inspection equipment, power device inspection equipment, display inspection equipment, glass inspection, film inspection, and other product series, offering customers a complete solution for inspection equipment.
HYMSON: First Micro LED Pilot Production Line Successfully Shipped
According to an August 1st announcement from HYMSON’s official WeChat account, the company’s first Micro LED pilot production line has been successfully shipped. This line includes Micro LED mass transfer, Micro LED mass welding, and Micro LED laser repair equipment, having passed factory FAT acceptance. The production line achieves an efficiency of 25-100kk/h with a process yield of over 99.99%, meeting the application requirements of Micro LED chips with a size of ≤50μm.
HYMSON stated that the successful shipment of the Micro LED pilot production line signifies that the company has fully bridged the “last mile” of converting display technology into practical applications, continuously accelerating the iteration of Micro LED display technology, process innovation, and large-scale production.
Notably, in recent years, HYMSON has continuously expanded its layout in the Micro/Mini LED field, being the first to achieve breakthroughs in key industry processes such as Micro/Mini LED cutting, transfer, bonding, inspection, and repair, and continues to tackle challenges in the chip segment, display module segment, and display integration segment processes.
Currently, HYMSON offers Micro LED laser mass transfer solutions, Micro LED laser mass welding solutions, and Micro LED laser mass repair solutions. Among them, the Micro LED laser mass transfer equipment has overcome bottlenecks in high-speed positioning, precise alignment, and laser processing technologies, achieving high efficiency and precision in the mass transfer of Micro LED chips. The Micro LED laser mass welding solution has achieved RGB three-color welding on substrates larger than 12 inches, with a yield rate of over 99.99% (excluding abnormal chips in the incoming material).
The Micro LED laser mass repair solution, combined with HYMSON’s self-developed AI integration system, can automatically identify repair positions and match micron-level spots to remove small 5μm Micro LED chips. After processing with this equipment, coupled with subsequent chip replenishment and welding processes, the panel’s lighting yield can reach 99.9999%.
In the first half of this year, HYMSON achieved two significant milestones. In January, HYMSON’s 1.964 billion yuan private placement was approved by the Shanghai Stock Exchange, with the funds to be used for the first phase of the Western Laser Intelligent Equipment Manufacturing Base Project, the construction of the HYMSON Laser Manufacturing Center Project, and to supplement working capital.
In May, HYMSON won the bid for land in Longhua, Shenzhen, where it plans to build a high-end laser and intelligent equipment R&D center and manufacturing base, covering applications in new energy batteries, photovoltaics, new displays, semiconductors, and consumer electronics. After completion, the project is expected to generate an annual output value of over 8 billion yuan, providing sufficient financial and production capacity support for HYMSON’s subsequent development.
AUO: Large-sized Micro LED TVs Already in Mass Production and Shipment
According to MoneyDJ, AUO disclosed its second-quarter results and progress in Micro LED applications. AUO stated that the company focuses on a dual-axis transformation, continuously reducing the revenue share of its Display business, expecting double-digit annual growth rates in both Mobility Solutions and Vertical Solutions over the next few years.
AUO noted that about 7-8 years ago, the company started developing FOPLP (Fan-Out Panel Level Packaging) technology, but decided to put it on hold due to its perceived low added value, complex competitive relationships, and limited market growth. Instead, the company concentrated on developing Micro LED technology, which has now led to the mass production and shipment of large-sized Micro LED TVs, available for purchase in the market. Additionally, AUO is developing AR glasses, wearable devices, and in-vehicle applications. In the automotive sector, AUO has new projects in joint development with customers, embedding Micro LEDs not only in the interior but also in external components such as headlights, taillights, trim, and radiators. These new projects are expected to take 2-3 years to come to fruition.
AUO pointed out that the Mobility Solutions business, which includes automotive and BHTC, has a larger base than the Vertical Solutions business. Initially, the revenue share of Mobility will exceed that of Vertical, but the growth momentum of Vertical is expected to be stronger, with a target to have Mobility and Vertical each accounting for more than 50% of revenue by 2027. This would result in a balanced three-way distribution of revenue among Mobility, Automotive, and Display, effectively reducing the impact of fluctuations in the panel industry.
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