As Mini & Micro LED products continue to innovate and capture larger market shares, the competition between COB and MIP has become intense. The choice of packaging technology plays a crucial role in determining the performance and cost of Mini & Micro LED displays.
What is SMD?
Traditional SMD technology involves packaging individual RGB (Red, Green, Blue) LED chips into light modules. These modules are then soldered onto PCBs using SMT technology, forming a unit that is later assembled into an LED screen.


What is COB?
COB (Chip on Board) refers to directly soldering multiple RGB LEDs onto a single PCB. This is followed by integrated encapsulation to create unit modules, which are then assembled into an LED screen.


COB can be classified into two types: Direct Bonded COB and Flip-Chip COB. The traditional direct-bonded design limits the performance of the product, specifically in terms of light angle and bonding distance. However, Flip-Chip COB improves upon this by enhancing reliability, simplifying production, and offering better display performance, especially in achieving a micro-level pitch and providing superior brightness, contrast, and color consistency. Unlike SMD, COB cannot perform optical binning on individual LEDs, so the entire screen must undergo calibration before leaving the factory.

With industry advancements, the cost of COB packaging has steadily decreased. In P1.2 pitch products, COB pricing has dropped below that of SMD, with the price advantage becoming even more apparent for smaller pitch products.
What is MIP?
MIP, or Mini/Micro LED in Package, involves cutting the LED chips on the panel into individual or multi-unit devices. After optically optimizing them, the devices are soldered onto PCBs using SMT technology to create LED display modules.

The approach is based on “deconstructing” the larger units into smaller components, allowing for smaller chips, reduced waste, higher display consistency, and lower costs. This method significantly improves production efficiency and enhances the performance of LED displays.
The MIP solution ensures color consistency through full-pixel testing, achieving cinema-grade color gamut standards (DCI-P3 ≥99%). It also helps eliminate defective pixels during the transfer process, reducing repair costs. Furthermore, MIP is more versatile and compatible with various substrates and pixel pitches, making it suitable for Micro LED applications in both small and large-sized displays.
What is GOB?
GOB (Glue on Board) is an innovation driven by market demands for higher product quality and improved display effects. This process, also known as “encapsulating the display with glue,” has two significant advantages:


- Superior Protection: GOB offers high protection against water, humidity, impact, dust, corrosion, blue light, salt, and static electricity.
- Enhanced Display Quality: The matte surface effect transforms point-source light into surface light, enhancing the viewing angle, improving contrast, and eliminating moiré patterns. It also reduces eye strain, delivering finer display effects.
Conclusion
Each packaging technology—SMD, COB, and MIP—has its own strengths and weaknesses. Choosing the right technology for specific applications is critical. As breakthroughs in technology and cost reductions continue, Mini & Micro LED will have an even greater impact across diverse industries. The current debate between COB and MIP is more about differentiation than one replacing the other.
Disclaimer: The views and opinions expressed in this article are those of the original authors and do not necessarily reflect the official policy or position of MiniMicroLED Insights . While we strive to ensure the accuracy and reliability of the information provided, the content on this website may include translations, re-edited versions of second-hand information, or information derived from unverifiable sources. MiniMicroLED Insights makes no representations or warranties, express or implied, regarding the completeness, accuracy, or timeliness of such content. The information in this article is for informational purposes only and should not be construed as professional advice. Any reliance you place on such information is strictly at your own risk. To the fullest extent permitted by law, MiniMicroLED Insights disclaims all liability for any direct, indirect, incidental, consequential, or punitive damages arising out of your use of, or reliance on, the information contained in this article.
Copyright Notice: This article may include translated and re-edited content derived from various online sources, including websites and social media platforms. While we strive to credit the original authors and sources to the best of our ability, we may not always be able to verify the original source of the content. All rights to the original content remain with the original author or source publication. Where applicable, this content is reproduced for educational and informational purposes under the fair use doctrine. If you believe any content on this site infringes upon your intellectual property rights, or if you are the copyright owner and believe we have not credited you correctly, please contact us at minimicroled.business@gmail.com. We will investigate and take corrective action, including removing or properly crediting the content if necessary.
Content sourced and adapted by MiniMicroLED Insights (Doris).