Micro LED Patent Overview
Shinju Semiconductor has recently announced that its patent for a “Micro-LED Chip and Its Fabrication Method” has entered the public review stage.
Micro LED Patent Details
This invention reveals a Micro LED chip and its fabrication method. The Micro LED chip consists of a first light-emitting layer, a second light-emitting layer, a third light-emitting layer, and a substrate, all stacked sequentially along the light emission direction. These layers are bonded together by an adhesive layer, which includes multiple transparent holes. These transparent holes are aligned with the light-emitting units of the light-emitting layers to ensure smooth light transmission.
Technological Innovation

The vertically stacked Micro LED chip utilizes the design of transparent holes to reduce the area through which light passes through organic materials. This innovation helps mitigate the issues of inconsistent light transmittance caused by the instability of organic materials and the color changes they can introduce. As a result, this technology significantly improves both light transmission efficiency and the overall light-emitting efficiency of the LED chip, reducing light loss.
Additionally, the design enhances the mixing of light, ensuring uniform color consistency across the entire display panel. The smaller size of the Micro LED also provides a significant boost in display performance, improving brightness and color purity. These advancements give the technology strong practical value and promising market potential.
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