The 10th International Third-Generation Semiconductor Forum & 21st China International Semiconductor Lighting Forum (IFWS & SSLCHINA 2024) and the Advanced Semiconductor Technology Application Innovation Exhibition (CASTAS) will be held from November 18-21, 2024, in Suzhou, China. The event, with the theme “Low-carbon Intelligence, Win-win with Unified Core,” will feature leading experts from the industry.
At this event, the Mini/Micro-LED Technology Industry Application Summit invited Dr. Jiang Zhenyu, Chairman and Founder of Qiushui Semiconductor, to deliver a keynote speech titled “Damage-free Micro-LED Chip Technology Based on Hybrid Bonding”. The presentation showcased Qiushui Semiconductor’s 8-inch hybrid bonding technology for damage-free Micro-LED digital automotive lighting chips. Dr. Jiang emphasized that 8-inch advanced semiconductor processing is the key to achieving ultra-high-yield processes in Micro-LED displays, and hybrid bonding technology is the best solution for heterogeneous semiconductor integration. It is the perfect link between light and electricity in Micro-LED technology and the ultimate path to unlocking the trillion-dollar chip market for Micro-LED.
Key Points of Dr. Jiang’s Speech
- Damage-free Micro-LED Technology
- Hybrid Bonding Technology
- 8-inch Hybrid Bonding Micro-LED Process by Qiushui Semiconductor
Damage-Free Micro-LED Technology
The damage-free Micro-LED technology addresses material damage issues at the fundamental level, creating a technology system that regulates current diffusion through structural design. This breakthrough solves the material damage caused by traditional physical insulation methods such as etching. The damage-free Micro-LED technology is a high-yield solution compatible with existing semiconductor processes, eliminating material damage and enhancing overall production efficiency.
Hybrid Bonding Technology
Hybrid bonding technology is a major driving force for advancing heterogeneous integration in the semiconductor industry. It has been successfully applied in CIS, 3D NAND, HBM, and other semiconductor chip fields. In the Micro-LED field, hybrid bonding brings diverse, multi-layer, multi-color heterogeneous integration architectures, ultra-high resolution with PPI > 20000, pixel yields greater than 6N, and high stability. It is the optimal solution for upgrading Micro-LED chip processes.
Qiushui Semiconductor’s 8-inch Hybrid Bonding Micro-LED Process
Qiushui Semiconductor has successfully overcome critical technology barriers in 8-inch Micro-LED hybrid bonding, achieving atomic-level interface control. This results in >95% perfect adhesion area, making it the first company to achieve 8-inch hybrid bonding Micro-LED process breakthroughs. Additionally, it has completed the packaging process for digital automotive lighting products and successfully lit the driving circuit.
Key Report Takeaways
- The Micro-LED microdisplay field is a trillion-dollar consumer market waiting to be unlocked, with trillion-dollar chip demand suppressed due to technological bottlenecks.
- 8-inch and larger semiconductor process technology is the necessary path for Micro-LED chip mass production.
- The damage-free Micro-LED technology route can fundamentally solve material damage issues, which have been a major hurdle in large-scale production.
- Hybrid bonding is the best bridge for heterogeneous integration in semiconductors and is the perfect connection between light and electricity in Micro-LED technology.
- Qiushui Semiconductor has released its 8-inch hybrid bonding Micro-LED digital automotive lighting chips.
At the IFWS & SSLCHINA 2024 summit, numerous new technologies showcased the forefront of technological advancements. The launch of Qiushui Semiconductor’s 8-inch hybrid bonding damage-free Micro-LED digital automotive lighting chips marks a significant step forward and will provide the industry with groundbreaking new experiences.
About Qiushui Semiconductor
Founded in November 2022, Suzhou Qiushui Semiconductor Technology Co., Ltd. specializes in damage-free Micro-LED chip technology developed by its founder. The company integrates 8-inch semiconductor hybrid bonding advanced processes to address key challenges in Micro-LED technology. These include issues such as high material damage, low optical efficiency, low process yield, and difficulty in colorization. By solving these core problems, Qiushui Semiconductor provides unique Micro-LED chip products to global clients.
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