Hunan Omnisun Information Materials Co., Ltd. (OIM), a leader in the Micro LED materials sector, has announced that it has successfully secured $103.6 million (¥740 million) in its Series B funding round. This follows the company’s $78.4 million (¥560 million) Series A financing earlier in 2024, marking the second round of funding within the year and bringing the total capital raised to $182 million (¥1.3 billion).
Investors and Funding Details
The latest round of funding saw continued support from the company’s actual controlling party, Hunan Energy Group, and existing investor Shenzhen Capital Group’s Manufacturing Industry Transformation and Upgrading New Materials Fund. New investors, including Zonggai Experimental (Shenzhen) Equity Investment Fund, Jiangfeng Electronics, Xingxiang Capital, and Xiangjiang Guotu, also participated in this round. The funds raised will primarily be allocated towards the Phase II semiconductor mask substrate project, with the capital fully secured.
Company Overview and Key Developments
Founded in August 2003, Hunan Omnisun Information Materials Co., Ltd. (OIM) is based in Xiangjiang New District, Changsha, Hunan Province, China. The company has established several sputtering coating chromium plate production lines, producing substrates ranging from 75×75mm to 700×800mm. These products are widely used in various fields, including flat-panel displays, integrated circuits, fine optics, circuit boards, micro-nano fabrication, and laser anti-counterfeiting.
In June 2024, Omnisun signed an agreement with the Xiangjiang New District Management Committee to establish its high-precision mask substrate project in the district. By December 26, 2024, the company began construction of its 8.6 generation and below high-precision mask substrate industrial park.
Future Investments and Production Plans
The total investment for this project is $248 million (¥1.8 billion), divided into two phases. The Phase I investment is $111 million (¥800 million) and will establish production lines for 8.6 generation and below high-precision mask substrates for flat-panel displays, covering demands for LTPS, LTPO, AMOLED, and Micro LED applications. The project is expected to begin production in December 2025.
Phase II, with an investment of $138 million (¥1 billion), will focus on building high-precision mask substrate production lines for semiconductor applications, catering to 28nm process requirements. Phase I production is scheduled for December 2025, while Phase II is expected to go live in 2026.
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