Reporter: Wang Xiaolei
MIP Technology (Mini/Micro LED-in-Package) is a chip-level packaging solution for Mini/Micro LED displays. It involves cutting chips into single devices or multi-chip modules, performing light-splitting and light-mixing processes, and executing SMT (surface-mount technology) procedures, with optional surface coating on the display panel, ultimately completing LED display production.
With rapid technological development, expanded production capacity, and steadily decreasing costs, MIP has significantly strengthened its position in the direct-view display market. Since the beginning of this year, companies such as Leyard, Xinying Optoelectronics, Unilumin, Ledman, and NationStar have launched a series of MIP products.
Sales Revenue Share Expected to Reach 35%
The year 2024 marks the first year of MIP development. As the technology matures further and costs continue to decline, the adoption of MIP is accelerating. According to data from Loto Technology, in the first quarter of 2025, MIP-packaged products accounted for 0.4% of the shipment area and approximately 0.3% of the sales revenue in China’s fine-pitch LED display market. It is projected that by 2028, MIP will capture a 35% share of the MLED direct-view market, becoming a key driver of display upgrades. The market anticipates MIP shipments to reach 5,000–10,000KK per month in 2025.
Prices Have Dropped to ¥8 per 1,000 Units
Pricing was originally an advantage, but current costs remain influenced by technical and market factors. According to Zhuang Wenrong, Chief Technical Advisor at Dongguan Altai Display Technology Co., Ltd., MIP prices have dropped to ¥8 per 1,000 units from the end of last year to the present. It is predicted that after the first quarter of next year, the price curves of MIP and COB will intersect.
Recently, Xiao Junlong, Vice General Manager of Chongqing Konka Optoelectronics Technology Co., Ltd., pointed out that for MIP to be more competitive in the market, its price needs to fall below ¥5 per 1,000 units in the coming years.
Cost Can Decrease by 70% When Monthly Capacity Reaches 10,000KK
By the end of 2024, Unilumin’s MIP production capacity reached 6,000KK per month. Unilumin’s MIP product line fully covers pixel pitches from P0.3 to P1.8, supporting MIP technology across diverse applications, including rental, commercial displays, outdoor displays, and creative display scenarios.
In March 2025, NationStar Optoelectronics revealed that the company had established a monthly MIP production capacity of 2,000KK. According to financial reports, Leyard’s first-phase high-end MIP product capacity has reached 1,200KK per month, with the second-phase planned capacity also at 1,200KK per month. Full production is expected by the end of the year, at which point Leyard’s self-built Micro LED capacity will exceed 4,000KK per month.
| 2025 MiP Product Release Summary (Incomplete Statistics) | |||
|---|---|---|---|
| Brand | Product Category | Product Information | Release Date |
| Leyard | LED Transparent Cinema Screen | The Huaxia Leyard 4 × 16m LED transparent cinema screen obtained DCI certification. | November |
| Sinyopto Optoelectronics & Fabulux Technology | 8K MiP LED Display | Launched the world's first 8K MiP large display together with Fabulux Technology at IBC 2025. Pixel pitch: P0.9. | September |
| Unilumin | Indoor Rental, Commercial Display, Outdoor Display, Holographic Display | March 2025: UslimII MiP 0.1.9 (world’s first outdoor MiP display) debuted at ISLE 2025; ULWIII MiP 0.9 (8K fine-pitch MiP) also showcased. April 2025: Displayed udesignSW MiP holographic transparent screen (SV3.9) at InfoComm China 2025. October 2025: Released the world’s first MiP 1.9 indoor rental display. | March, April,October |
| Qingsong Optoelectronics | Home Theater All-in-One | 162-inch 4K home theater all-in-one system. | June |
| Ledman Optoelectronics | Home Theater All-in-One | New Micro-grade MiP product with 0.9mm pixel pitch. | March |
| NationStar | Micro LED Large Screen | February: Displayed MiP series ultra-HD display components at ISE, including MiP-CIMD12, MiP-AIMD19, MiP-AIMD26, and display panel modules such as MiP0606, MiP0404, MiP0303. April: Released MiP Panel AS Series. | February, April |
| Lekin Semiconductor | Micro LED Chip | Released the industry’s first silicon-based GaN single-chip full-color Micro LED chip — LEKIN-SiMiP. | February |
| AOTO Electronics | Commercial Display Screen | MiP-based commercial display series covering 0.9mm, 1.2mm, 1.5mm, 1.8mm pixel pitch options. | February |
| Kinglight | Components | MiP1010, specialized for outdoor 8K ultra-HD display, adopting common-cathode + common-anode flip-chip design; contrast ratio >20,000:1, brightness boosted by 40%. Suitable for outdoor advertising and sports events. | January |
Sinyopto Optoelectronics’ production plan indicates that it will reach a monthly output of 4,000KK in Q4 2025.
Aimap plans to increase its production capacity to 5,000KK per month by the end of 2025, continuously enhancing market supply capabilities.
In addition, in March of this year, Hangzhou Xinjv Semiconductor commenced a 50,000KK Micro LED MIP (next-generation display technology) R&D and production project, which will accelerate the adoption of micro-LED products in commercial displays, large-size TVs, automotive displays, and other fields.
With the increase in production capacity, industry estimates suggest that MIP costs could decrease by 50%–70% due to economies of scale, particularly when monthly output reaches 10,000KK, where cost reductions could reach up to 70%.
Development Bottlenecks: Insufficient Equipment Precision, Yield Improvement Needed, Low Industry Chain Maturity
As a packaging solution for Mini/Micro LEDs, MIP technology faces three core bottlenecks: insufficient equipment precision, the conflict between efficiency and yield, and low maturity of the industry chain.
Equipment Precision Bottleneck
MIP packaging requires extremely high mechanical positioning accuracy and dynamic error compensation capabilities from equipment such as dicing machines. As Mini/Micro LED chips shrink in size (e.g., below 50 microns), the tolerance for cutting errors is significantly reduced, and traditional equipment struggles to meet micron-level precision requirements. For example, the BJX8160 dicing machine launched by Bojie Chip is specifically designed to address this issue.
Efficiency vs. Yield Conflict
High-speed dicing can easily cause chip edge chipping, burr increase, and even delamination between the epitaxial layer and substrate. At the same time, the “thin” and “high-hardness” characteristics of the chips place higher demands on blade selection and wear control. Excessive blade wear can interrupt the continuity of cutting.
Low Industry Chain Maturity
MIP technology is still in the mass-production introduction phase, but the overall industry chain maturity is insufficient, resulting in higher manufacturing costs. For example, yield issues in mass transfer technology have not been fully resolved, and the packaging stage accounts for 40% of costs, limiting large-scale application.
Technology Path Exploration
Some manufacturers reduce investment by adopting fan-out packaging (e.g., NationStar Optoelectronics’ blackened substrate solution) or by making their processes compatible with existing equipment (e.g., Jingtai Optoelectronics’ MC series), but a unified standard has yet to emerge.
Insufficient Cost Competitiveness
Although MIP technology reduces some costs through solutions like fan-out packaging, the overall cost of end products still needs to decrease further to compete with existing technologies such as Mini COB.
Breakthrough Points: Industry Chain Collaboration, Technology Iteration, Equipment Innovation
The key directions for breakthroughs in MIP technology (Mini/Micro LED in Package) are concentrated on industry chain collaboration, technological iteration, and cost optimization. Specific analyses are as follows:
Industry Chain Collaboration
Upstream chip manufacturers, midstream packaging companies, and downstream panel enterprises work together to drive production capacity expansion.
Technological Iteration
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Mass Transfer Technology: Innovative processes such as laser mass transfer enhance chip-level packaging precision.
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Leyard Advanced MIP (MicroLED in PKG) Products: These use full-flip, substrate-free Micro LED chips smaller than 50μm, with over 99% black coverage, excellent color temperature and chromaticity viewing angle consistency, packaging supporting 0303/0404 chips, and a common cathode design for greater energy efficiency and low power consumption.
Equipment Innovation
Companies like Hans-Toplight have introduced complete sets of equipment for excimer laser lift-off and laser mass transfer, compatible with both MIP and COG packaging, accelerating the transition of laboratory technologies to mass production.
Conclusion
MIP technology is gradually maturing and accelerating adoption across multiple application scenarios. However, key areas such as cost control, yield improvement, and industry chain maturity still require breakthroughs. Looking ahead, the industry is expected to focus on collaborative efforts across the supply chain to overcome development bottlenecks and further accelerate the commercialization of MIP technology. With combined efforts from all parties, MIP technology is likely to expand into cinemas, XR studios, stage rentals, and other diverse scenarios, delivering more immersive and visually compelling experiences to the public.