With the development of Mini/Micro LED technology and the growing trend of small-pitch product applications, LED packaging technology has entered a new era with the diversified development of COB, MiP, SMD, and COG technologies.
Among these, MiP technology is a chip-level packaging technique, where Micro LED chips are massively transferred to the substrate on the epitaxial wafer, then directly packaged, cut, and tested for light mixing. A key feature of this technology is that it inherits the SMD manufacturing process, making it highly compatible with existing production equipment and reducing the need for heavy investment in new assets.
As a result, many companies in the industry view MiP as a critical technology for the future of LED packaging, continuing to push its development forward. Recently, there have been several updates on the latest advancements in MiP technology within the LED industry.
I. Strategic Partnership Between Sinyopto and Aimaipu on MiP
On February 14, Hubei Sinyopto Co., Ltd. (hereinafter “Sinyopto“) and Hubei Aimaipu Optoelectronics Technology Co., Ltd. (hereinafter “Aimaipu”) officially signed a MiP (Micro LED in Package) strategic cooperation agreement. The core of this strategic collaboration is to integrate the technological and resource advantages of both companies to drive the commercialization of Micro LED display technology. Click here to read more.
It is reported that Sinyopto and Aimaipu complement each other in areas such as Micro LED chip technology, chip-level packaging, mass transfer technology, and panel-level packaging technology. The two companies will jointly work to streamline the entire industry chain from chips, packaging, to applications, improve product competitiveness, and accelerate the adoption of Micro LED display technology.
Through this collaboration, both companies will leverage MiP packaging and panel technologies to significantly enhance display product performance and accelerate industrialization. The focus will be on the Micro LED small-pitch display market, such as high-end TVs, all-in-one machines, and high-end cinema applications, while also exploring the high-end markets for AR/VR and automotive displays.
Sinyopto has revealed that they are jointly developing the next-generation revolutionary product, AMiP, which integrates AM Micro IC and Micro LED in a single package. The introduction of AMiP will support the transition of LED displays from passive to active driving, significantly improving display quality.
II. LEKIN Semiconductor Releases the First Silicon-based GaN Single-chip Full-color Micro LED Chip LEKIN-SiMiP
On February 17, Suzhou LEKIN Semiconductor Co., Ltd. (LEKIN) announced the launch of the industry’s first silicon-based GaN single-chip integrated full-color Micro-LED chip — LEKIN-SiMiP®. The chip is already in collaboration with several display customers, including HKC, to validate its application in Micro-pitch LED direct-view displays. This breakthrough technology overcomes the challenges of mass transfer, greatly improving direct yield rates.
LEKIN’s SiMiP is an advanced MiP technology that adopts a single-chip integrated solution, eliminating the need for complex mass transfer and repair processes. This significantly improves yield rates. By innovating the technical approach, LEKIN has reduced the complexity of traditional processes and avoided the use of toxic materials, making it more environmentally friendly. The red, green, and blue primary color pixels exhibit high consistency in emission wavelength, operating voltage, and light distribution, addressing the color deviation issues found in traditional solutions.
III. ISE 2025: Continuous New MiP Products
At the recently concluded ISE 2025 in early February, MiP-related technologies and new products were one of the key highlights of the event.
For example, AOTO Electronics launched their MiP series commercial display screens with a contrast ratio of 10,000:1.
Nationstar presented its MiP products for Ultra HD displays, including devices such as MiP-CIMD12, MiP-AIMD19, and MiP-AIMD26, along with modules like MiP0606, MiP0404, and MiP0303.
Kinglight unveiled the MiP1010 outdoor display, which features high thrust, wide viewing angles, flip-chip design, and versatile common cathode-anode configurations.
These developments at the exhibition demonstrate industry confidence in the future growth of MiP technology.
IV. Industry Leaders Accelerating MiP Capacity Expansion
On the production side, MiP capacity is also increasing. In November last year, LEYARD announced the mass production of its self-developed advanced MiP production line, with yield rates exceeding 95%.
The first phase of this advanced MiP production line has a capacity of 1.2 million units/month, with plans to expand it to 2.4 million units/month in phase two. This will accelerate the cost-reduction and efficiency-improvement process for Micro LED displays, bringing more cost-effective, high-quality products to the market, and boosting demand for ultra-small-pitch P1.0 and below Micro LED displays.
As a leader in the LED display industry, LEYARD’s significant expansion in MiP production is a strong indicator of the technology’s future.
In addition, more companies are joining the MiP production capacity expansion. For example, in December last year, San’an Optoelectronics subsidiary Aimaipu Optoelectronics announced the successful development and mass production of Micro LED MiP0404, MiP0202, and Micro LED display panels such as MiP0.78 and MiP0.9. They now have a MiP (Micro LED in PKG) production capacity of 2 million units/month, with plans to expand it to 5 million units/month by the end of 2025.
V. Summary
The development of MiP packaging technology is booming, and in the near future, MiP and COB technologies are expected to dominate various pitch applications, driving the growth of the LED display market.
As COB and MiP technologies continue to mature, the cost of ultra-small-pitch LED displays is decreasing, and the LED display market is expected to maintain rapid growth. The market size for ≤P2.5 LED displays will reach $7.39 billion by 2027, with a CAGR of 12%, and the market size for ≤P1.0 LED displays will reach $1.15 billion by 2027, with a CAGR of 34%.
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