At the recent 2020 NationStar Light Forum, Qin Kuai, Deputy General Manager of NationStar’s RGB Device Division, emphasized in his keynote speech, “The Industrial Evolution from ‘Screen’ to ‘Device’ in LED Displays,” that the rapid advancement of LED display technology has made 100-inch 4K/8K Mini LED displays an inevitable trend toward industrialization.
In recent years, LED display technology has continued to advance, driven by the market’s demand for more diverse, specialized, and high-quality products. The pixel pitch of LED displays is shrinking, particularly in high-end applications where products with pitches of P0.9 or even smaller are emerging.
In September, LG launched the 163-inch Magnit, a giant TV with 4K resolution and a P0.9 pixel pitch. Similarly, in July, Leyard unveiled four new LED display products with pixel pitches ranging from P0.4 to P0.9.
As we progress through 2020, LED display manufacturers continue to push boundaries with the introduction of ultra-small pitch products like P0.4 and P0.6, readying for mass production. This indicates that Mini LED displays are set to penetrate emerging markets such as commercial displays.
IMD Packaging Solutions: A Winning Combination of Technology and Cost
Currently, there are three main packaging solutions for Mini LED displays with pixel pitches below P1.0: SMD packaging, COB packaging, and IMD packaging. What sets these solutions apart?
SMD Packaging
SMD (Surface-Mounted Device) packaging aims to achieve smaller pixel pitches by mounting one or more LED chips onto a metal frame with a plastic “cup-shaped” outer shell. Liquid epoxy resin or silicone is poured into the plastic shell and cured at high temperatures, before being cut into individual surface-mount devices.
However, as the device size continues to decrease, SMD packaging faces challenges related to circuit precision, such as PCB accuracy and cutting precision, resulting in higher costs due to the increased number of PCB layers. Additionally, SMD packaging suffers from lower reliability, weaker protection, and vulnerability to damage, with P0.4 being the production limit for mass-scale SMD packaging.
COB Packaging
COB (Chip on Board) packaging involves using integrated packaging technology where bare chips are bonded to an interconnected substrate with conductive or non-conductive adhesives, followed by wire bonding to achieve electrical connections.
COB technology offers advantages such as high reliability, efficient full-screen assembly, and soft surface lighting. It can theoretically be applied to displays with any pixel pitch, even those at the millimeter level. However, the materials required are expensive, and achieving uniformity in display and appearance demands significant costs.
IMD Packaging
IMD (Integrated Matrix Device) packaging is a new integrated packaging technology where multiple related pixels are combined into a single package based on LED display circuit principles.
This approach merges the low cost and good color consistency of SMD packaging with the high reliability and impact resistance of COB packaging. It effectively addresses issues like seams, light leakage, and maintenance difficulties.
Most importantly, IMD packaging significantly reduces costs for display manufacturers. For example, P0.9 to P0.5 displays only require a 6-layer 2-stage PCB, and the SMT efficiency is more than three times that of SMD packaging. For packaging factories, IMD packaging allows the use of existing small-pitch packaging production lines, reducing capital investment. Together, IMD packaging offers the most comprehensive solution for the challenges facing the LED microdisplay industry.
NationStar’s IMD Series Accelerates Mini LED Display Commercialization
Thanks to its strategic foresight and strong execution, NationStar has rapidly advanced its IMD series since its initial release in 2018. The IMD series has now evolved into its third generation, covering P0.9, P0.7, and P0.5 pixel pitches, meeting various market and manufacturer demands across a wide range of applications. NationStar’s IMD series has already achieved industry-leading shipment volumes.
As a leading domestic LED packaging enterprise, NationStar is committed to exploring new applications, developing cutting-edge technologies, and providing competitive microdisplay LED packaging solutions, making it a trusted strategic partner for customers.
For example, in early 2019, NationStar’s IMD-M09T product was adopted in a project by the Nanjing Public Security Bureau in collaboration with AOTO Electronics. Additionally, Mini LED products developed by leading screen manufacturers such as Unilumin and Absen also rely on NationStar’s IMD packaging solutions.
Looking ahead, NationStar will continue to focus on high-definition displays, driven by market demand and a steadfast commitment to innovation. The company aims to achieve new breakthroughs in product and technology development, offering the market practical, superior technical solutions that drive the high-quality growth of the LED microdisplay industry.
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