Micro LED technology has been accelerating the transition of AR glasses from B2B to B2C applications, powering upgrades in products like micro projectors, digital car lights, 3D printers, and in-vehicle HUD (Heads-Up Display) systems. This is due to the fact that Micro LED chips typically have a pixel size smaller than 10μm, offering brightness levels above 2.5 million nits, which meets the eye-entry brightness requirements for AR glasses.
Currently, over 10 AR glasses manufacturers have adopted Micro LED optics as their imaging source. This shows that AR glasses with displays are quickly becoming the ultimate form of smart eyewear. However, large-scale mass production of AR glasses still depends on the maturity of optical display systems and cost control capabilities.
I. Mainstream Optical Display Systems and Solutions for AR Glasses
Optical Display Systems:
The main optical display systems include LCOS, OLED, and Micro-LED. For example, Weir Group has launched LCOS panels that are compatible with various AR glasses. Epson’s BT-350 uses its own silicon-based OLED, while Nreal AR glasses also use OLED technology. Sunny Optical Technology has pioneered the mass production of monochrome and color Micro LED optics.
Optical Solutions:
Optical solutions primarily rely on thin, high-transparency waveguide technology, which can be categorized into reflective and diffractive types based on the optical path. In 2024, Meta released its first modular AR glasses, Orion, utilizing a Micro LED + waveguide optical solution. The field of view reached 70°, and although it was not aimed at the consumer market, this technology path has provided an important reference for the industry. In 2025, Rokid launched its Glasses series, which integrates Tongyi Qianwen’s large model and employs diffractive waveguide technology to overlay virtual interfaces onto the real-world environment. Additionally, brands like Thunderbird and Rokid have equipped some of their AR glasses with Micro LED micro-displays.
Micro LED technology’s application in AR glasses holds vast potential. By 2030, the AR device market is expected to reach 25.5 million units, with Micro LED’s market share predicted to grow to 44%.
II. Mainstream Micro LED Chip Packaging Processes
Micro LED is a display technology composed of micron-sized LED chips. Its manufacturing involves eight major processes and over 200 small procedures, including epitaxial layer growth, bonding and detachment, photolithography, etching, film deposition, electrode fabrication, chip cutting, packaging, testing, and sorting. The main LED packaging methods are:
- Dual In-line Package (DIP): A process where LED chips are inserted directly into a PCB board and then welded to create a display module.
- Surface Mounted Devices (SMD/IMD SMD): This method involves encapsulating individual LED chips into light bulbs, which are then mounted onto a PCB board to create LED modules with different pitch distances.
- Integrated Matrix Devices (IMD): This packaging structure contains four basic pixel units, with the “4-in-1” approach being the most common. It represents an intermediate step between discrete SMD devices and Chip-on-Board (COB) packaging.
- Chip-On-Board (COB): This involves mounting the LED chips directly onto the PCB using flip-chip technology, allowing for multi-chip integration without the need for a separate package.
- Chip-On-Glass (COG): In this method, LED chips are directly attached to a glass substrate (such as TFT or TGV), allowing for pixel pitches as small as 0.1mm.
- Glue-On-Board (GOB): New optical thermal nano-fill materials are used to encapsulate LED chips and PCB boards, creating a dual surface optical treatment for conventional LED displays.
- Mini/Micro LED in Package (MIP Micro): This process cuts Mini/Micro LED chips into individual or multi-chip units, and through a series of steps such as mass transfer, packaging, cutting, and optical mixing, the display screen is produced.
III. Precision Dispensing/Cutting in AR/VR Applications
Precision dispensing and cutting play a crucial role in the AR/VR field. For example, in backlighting technology, ultra-high precision and stability dispensing equipment is required to ensure accurate application of adhesive between tiny LED chips, improving display performance and enhancing product reliability and longevity. In the cutting process, high-speed rotating grinding wheels combined with optical inspection systems ensure cutting accuracy within 10μm, while cooling systems prevent thermal damage and microcracks.
To meet these technical requirements, Shenzhen Tensun Precision Equipment Co., Ltd. (Tensun) offers a comprehensive and mature solution for dispensing and cutting processes in the emerging display sector. Tensun provides customized solutions tailored to clients’ product needs.
About Tensun
Shenzhen Tensun Precision Equipment Co., Ltd. was founded in July 2006. It integrates the research, design, production, sales, and service of precision equipment, and is recognized as a national high-tech enterprise and a key national “specialized, refined, distinctive, and innovative” small giant enterprise. Tensun continues to focus on the research and innovation of precision equipment, including precision dispensing equipment, precision scribing equipment, precision bending lines, and 3C automation customized equipment. These products have been widely applied in 3C consumer electronics, display/screens, and semiconductor packaging fields.
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