The Importance of Micro-LED Mass Transfer Technology
The mass transfer technology is a critical step in Micro-LED display development, aiming to efficiently and precisely transfer a vast number of tiny LED chips from the growth substrate to the target driving substrate, forming high-density, high-quality display arrays. Since Micro-LEDs are significantly smaller than conventional LEDs, the transfer process presents considerable challenges, particularly in terms of quantity, speed, precision, yield, stability, and cost. As a result, mass transfer technology has become the pivotal factor in the large-scale commercialization of Micro-LED technology.
Challenges in Micro-LED Mass Transfer Technology
The primary challenges of Micro-LED mass transfer technology include efficient transfer, reliable bonding, rapid detection, and repair. Typically, a display screen requires the transfer of hundreds of thousands or even millions of LED chips, placing extreme demands on transfer precision, efficiency, and stability. Reliable bonding refers to the strength of the connection between Micro-LED devices and the backplane, ensuring no new defects arise during product usage. Rapid detection and repair involve quickly and accurately locating defective pixels on the display and replacing them, ensuring the screen achieves 100% illumination. These challenges directly impact the industrial scalability of Micro-LED technology.

VISTAR‘s Approach to Improving Micro-LED Transfer Efficiency and Yield
VISTAR has significantly enhanced Micro-LED transfer efficiency by combining stamp transfer and laser transfer technologies. Stamp transfer, known for its high precision and well-established industry chain, provides stability and reliability during the transfer process, though its efficiency is relatively low. Laser transfer, on the other hand, excels in efficiency and flexibility, demonstrating rapid adaptability in Micro-LED chip transfer, particularly suitable for developing hybrid binning techniques, albeit with lower precision. By integrating these two technologies, VISTAR has achieved an optimal balance between transfer efficiency and accuracy, with current transfer rates reaching 10 million chips per hour.
To improve transfer yield, VISTAR managed to increase its transfer yield from 99.99% to 99.995% within just three months. The technical team continuously optimized both the stamp and laser transfer processes, refined the manufacturing workflow, and enhanced substrate processing precision, resulting in high-yield transfers.

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