Pixel pitch is one of the key parameters for LED displays. With the growing demand for high-quality image playback on large-scale displays, Mini LED and Micro LED screens have emerged and gradually become mainstream technologies. However, the commercialization of Micro LED faces challenges, such as high-volume transfer yield, substrate yield, and pixel uniformity of the panel, which have become significant bottlenecks in its development. In this context, collaboration across the entire industry chain is essential to solve these technological hurdles. At the packaging end, Micro LED in Package (MIP) has emerged as one of the most promising packaging technologies, offering high-performance, low-cost display solutions in the fine-pitch LED display sector.
I. What is MIP Packaging?
MIP, short for Micro LED in Package, is a new packaging technology based on Micro LED. This process utilizes mass transfer technology to transfer Micro LED chips onto substrates for packaging. These chips are then cut into small packages, which are subsequently used for optical separation and light mixing, followed by the assembly process. This method significantly reduces manufacturing costs and increases the production yield of fine-pitch LED displays.
The process flow for MIP packaging is shown below:
II. Technical Advantages of MIP Packaging
As an innovative packaging solution, MIP offers seamless integration of LED chips with discrete components, providing Micro LED displays with enhanced performance and multiple advantages.
1. Enhanced Display Quality
MIP packaging enables comprehensive measurement of Micro RGB pixels, offering precise and detailed light separation. Experimental data confirms that, from various viewing angles, MIP-packaged LED modules exhibit outstanding performance in terms of brightness, contrast, and color consistency.
2. Lower Maintenance Requirements
When a faulty LED is detected in a display using MIP packaging, the faulty module can be removed and replaced without affecting other sections of the screen. Furthermore, MIP-based MCOB-packaged LED panels offer uniform black effects and perform well in light separation and mixing, requiring no additional calibration or maintenance. Compared to traditional packaging technologies, MIP reduces the need for post-production maintenance.
3. Reduced Costs
Traditional COB technology imposes strict requirements on Mini LED chips, leading upstream chip manufacturers to spend excessive costs on color separation, mixing, and other processes. In contrast, MIP packaging enables mass production, which reduces wafer costs. Additionally, MIP packaging lowers defect rates and downstream rework costs. Since this technology is compatible with existing equipment, it also avoids the need for new equipment purchases and significant R&D investment.
4. Superior Protection Performance
MIP packaging offers excellent dustproof, moisture-proof, and electrostatic protection, enhancing the LED modules‘ durability and resistance to external impacts.
5. Excellent Heat Dissipation
The MIP-packaged LED modules provide superior heat dissipation, leading to lower power consumption and reduced temperature rise.
MIP: The Next Big Thing After COB
Currently, MIP is the hottest packaging technology after COB. It offers compatibility with older equipment while providing superior display performance, making it highly attractive to the market. With robust momentum in the fine-pitch sector, and research and development investments from leading manufacturers like Nationstar, Kinglight, and HCP Technology, the commercialization of Micro LED is set to become even more promising in the future.
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