On February 18, 2025, the Sichuan Provincial Science and Technology Evaluation Office, following the relevant regulations of the Ministry of Science and Technology’s “Scientific and Technological Evaluation Measures,” invited seven experts from the industry to evaluate the “Micro LED Fully Automatic Bonding Machine” project developed by Huancheng Intelligent Equipment (Chengdu) Co., Ltd. The evaluation adhered to the principles of scientific, independent, objective, and impartial judgment.
The expert committee was composed of industry leaders, including Li Bo, Vice Dean of the School of Aeronautics and Astronautics at the University of Electronic Science and Technology of China, Hu Song, Researcher at the Institute of Optoelectronics, Chinese Academy of Sciences (former Director of the Microelectronics Equipment Research Lab), Deng Bin, Professor at Southwest Jiaotong University, Huang Dagui, Professor at the University of Electronic Science and Technology of China, Yi Yong, Professor at Geely College, Wang Haishi, Professor at Chengdu University of Information Technology, and Sun Ke, Director of the Chengdu Productivity Promotion Center. He Jun, R&D Director and Senior Engineer at Huancheng Intelligent Equipment (Chengdu) Co., Ltd., presented the project details.
The experts reviewed the presentation, followed by questions and discussions. The project was recognized for addressing the high precision requirements for pressure and temperature during the large-scale transfer bonding of Micro LED. The fully automatic bonding machine developed can accommodate both 4-inch and 6-inch Micro LED wafers, achieving fully automated operations for wafer loading and unloading. The project also introduced innovative methods, including multi-layered, multi-material soft-hard integration heat disk design, bottom insulation, and top heat conduction material coordination.
The product has already been applied by HC SEMITEK (Guangdong) Co., Ltd., a leading player in the Micro LED sector, yielding significant economic and social benefits. The expert panel concluded that the technology has reached an internationally advanced level.
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