In a keynote address at the 2023 High-Tech LED Display Industry Summit, Chunwei Yan, R&D Director of Kinglight‘s Packaging Division, highlighted the transformative potential of Micro LED in Pixel (MIP) technology for the LED display industry. He emphasized MIP’s key advantages, including cost-effectiveness, high brightness, low power consumption, strong compatibility, and improved display consistency, making it a preferred choice for leading LED packaging and display companies in the large-scale Micro LED sector.
Growing Demand for Micro LED in Pixel (MIP) Technology
“Small and micro pitch displays are experiencing rapid growth, and the market demand for these technologies will only increase,” Yan stated. “MIP technology enables smaller pitches and higher resolution displays, which aligns with the development trends of the LED display industry, while also offering the benefits of low cost and low technical complexity.”
Since the latter half of 2022, MIP packaging has become a critical choice for several leading LED packaging and display companies in the large-scale Micro LED field. Its cost advantages and performance benefits have attracted top manufacturers such as Kinglight, Leyard, and Nationstar, who are all focused on developing and producing MIP technology.
What is Micro LED in Pixel (MIP) Technology?
MIP technology involves the chip-level packaging of Micro LED chips in the front-end process. The packaged MIP is then encapsulated into MCOB (Molded Chip On Board). Leading companies like Sony, LG, and Christie have showcased products related to MIP technology at the 2023 ISE exhibition.
As a leader in the MIP field, Kinglight unveiled its new full range of MIP products at the 2023 ISE exhibition. Kinglight’s MIP packaging products are highly compatible and widely applicable, achieving mixed crystal and color separation for superior display effects. With an inverted common cathode structure, they provide higher reliability and energy efficiency.
Innovative MIP Packaging Techniques
Yan explained that MIP technology utilizes fan-out packaging and smaller Micro LED chips, allowing for larger pin solder pads. This approach addresses the common challenges in downstream processes, reduces the precision limitations of downstream substrates, enhances production yield rates, and significantly lowers the overall cost of Micro LED technology.
Kinglight’s MIP products incorporate advanced needle piercing and laser welding technologies, semiconductor carrier-level substrates, and high-precision chip transfer methods. These innovations result in more uniform product displays and eliminate mottling at large viewing angles. The MIP products can be arranged in various combinations to form modules, making them suitable for a wide range of pitch options from P0.5 to P1.25, thereby enhancing their versatility.
Key Advantages of Kinglight’s MIP Products
The most notable advantages of Kinglight’s MIP products are their low technical difficulty and high production efficiency. These products can be manufactured using existing SMT equipment and are easy to repair. Additionally, they can be encapsulated into MCOB using optical glue, providing excellent resistance to impact, moisture, and dust.
Yan concluded by stating that Kinglight’s MIP solutions help downstream customers further reduce costs, enabling more flexible manufacturing processes and greater autonomy in production.
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