On June 4, Leyard stated during a meeting with investment institutions that Micro LED is one of its strategic products. Currently, the commercially available Micro LED features a PCB-based MIP packaging format, which includes both single-pixel packaging known as “Diamond” and integrated LED packaging called “Nin1.” In the second half of this year, the company will introduce Micro LED products with substrate-free chips measuring less than 50μm, expanding the pixel pitch to 0.3mm to meet the needs of commercial and high-end home displays.
Technical Advancements
Since the commencement of Micro LED mass production in 2020, Leyard has primarily focused on the MIP (Micro LED Integrated Packaging) technology path. In recent years, the company has continuously upgraded its Micro LED products while optimizing costs. As chip sizes continue to shrink, the advantages of MIP will become increasingly apparent.
OEM Strategy and New Products
Currently, Leyard plans to adopt an OEM approach to produce COB (Chip-On-Board) packaged Micro LED modules, creating Micro LED display products to meet diverse customer needs. Additionally, Leyard is collaborating with industry panel companies to co-develop COG (Chip-On-Glass) Micro LED products, aiming to further reduce costs by changing substrates and expanding market opportunities.
Recently, Leyard officially delivered the country’s first ultra-large P0.7 Micro LED display screen to the National Energy Group’s Huanghua Port Command and Dispatch Center, with an area of 127 square meters. This screen employs Leyard’s next-generation MIP technology, achieving a resolution of 32,256 x 6,480 pixels.
Investment in R&D
Focusing on technological development, Leyard plans to invest in a new factory in the Huli District of Xiamen in 2024, concentrating on “next-generation high-end Micro LED packaging display technology.” The investment will include the construction of multiple MIP production lines, primarily researching substrate-free Micro LED mass transfer, soldering, and cutting technologies, while producing MIP products ready for mass production. This aims to ensure sustained high growth in its Micro LED (MIP, COB) business.
Cost Reduction Efforts
Simultaneously, Leyard is committed to reducing costs for Micro LED. A core theory of its MIP approach is that future chip sizes will become increasingly smaller, thereby reducing the proportion of chip costs in the overall product. As display performance improves, costs are expected to decrease, and the advantages of MIP will be more pronounced with smaller chips. The high-end MIP set to launch this year will utilize chips below 50μm, further contributing to cost reductions.
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