According to information from the National Intellectual Property Administration, Huizhou Ledman Optoelectronics Technology Co., Ltd. has filed a patent for a “Manufacturing Method for Mini/Micro LED Printed Circuit Board and Its Lamp Surface Processing Technology,” with publication number CN119050211A, filed in August 2024.

The patent abstract reveals that the invention discloses a lamp surface processing technology for Mini/Micro LED printed circuit boards. The Mini/Micro LED printed circuit board consists of a substrate and a solder pad located on the lamp surface on one side of the substrate. The lamp surface processing technology includes the following steps: applying dry or wet film to the lamp surface to expose the solder pad, selectively surface treating the solder pad, and then exposing and developing to dissolve and remove the dry or wet film from the lamp surface. Accordingly, the invention also discloses a method for manufacturing the Mini/Micro LED printed circuit board using the above-mentioned lamp surface processing technology.
This lamp surface processing technology does not include solder mask design when processing the lamp surface of the Mini/Micro LED printed circuit board, ensuring that the solder pad is higher than the circuit edge and the surface of the solder pad is metallic. The surface tension and roughness can be controlled, ensuring good leveling of the bottom fill material in subsequent processes and improving consistency in leveling.

Recent Developments in Glass-Based MicroLED Technology
Additionally, Ledman Optoelectronics recently announced that the company has achieved small-batch trial production of PM-driven glass-based MicroLED display panels. The company is actively exploring and upgrading glass-based technology and building patent protection barriers around this technology.

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