Currently, the exploration of Micro LED industrialization primarily combines two mainstream technological routes: Chip-on-Board (COB) and Mini/Micro LED in Package (Mip). These technologies are widely applied across various products. COB technology is mainly used in indoor small-pitch, micro-pitch, curved, and unconventional LED displays, as well as virtual pixels; Mip is primarily utilized in quasi-Micro LED displays, DCI color gamut cinema screens, and XR virtual filming.

Understanding Mip Technology
Mip (Mini/Micro LED in Package) packaging technology involves chip-level packaging of Mini/Micro LED chips. This process includes steps such as cutting chips into individual devices and performing optical mixing to create display screens. This packaging technology seamlessly inherits the “surface mounting” process and, as the prices of Mini/Micro LED chips decrease, it significantly drives the micro-pitch market towards low-cost technological iterations.


Mip employs a fan-out packaging architecture, achieving connections through “enlarged” pins. Compared to COB, Mip lowers the precision requirements for substrates, improving production yields. Additionally, Mip’s manufacturing process is less complex and more cost-effective than COB, avoiding the challenges associated with module PCB manufacturing and placement. One advantage of Mip technology is its ability to produce using existing processes, although it still faces issues such as low solder volume, shrinkage, warping, die bonding precision, and color block uniformity.
Advantages of Mip Packaging
Mip packaging boasts several benefits:
- Strong Compatibility: It can adapt to various pixel pitches and display effects. For instance, a 0.4 MIP device can produce LED displays with pixel pitches ranging from P0.5 to P1.2mm, whereas COB and IMD’s pixel pitch is determined by the packaging size. MIP technology’s compatibility with traditional LED display manufacturing processes gives it an edge over other technologies.
- Minimal Investment: LED display manufacturers can leverage their existing SMT equipment with minimal additional investment.
- Good Protection: It prevents the impact of dust, moisture, and static electricity.
- Effective Heat Dissipation: This technology significantly reduces power consumption and temperature rise.
- High Contrast: It achieves ultra-high black levels and wide viewing angles.
- Convenient Detection and Repair: Defective LED chips can be directly removed without rework.

Currently, the cost of MIP technology for producing P1.2mm displays is comparable to that of COB and SMD technologies. However, for smaller pixel pitches, MIP technology is more cost-effective; for example, when producing P0.8mm displays, MIP technology’s costs are lower than those of COB and SMD technologies.
Challenges Facing Mip Technology
While MIP has unique advantages, it still has limitations compared to COB. In terms of reliability and stability, COB technology holds a certain advantage. Moreover, because COB lacks the LED cup packaging stage, its costs are significantly lower than Mip’s at the same scale. Mip is primarily applied in the Mini LED sector, with products targeted at commercial displays, virtual filming, and consumer markets. These sectors hold substantial potential for the future, making Mip a strong candidate for mainstream packaging technology.
At present, both COB and Mip represent high-cost technologies, particularly in the ultra-micro-pitch market, where they face challenges related to the mass transfer of products. Consequently, the competitive focus between COB and Mip largely centers on who can better reduce costs and improve quality for Micro LED applications.
It remains difficult to determine which technology holds a greater advantage. Both are currently serving different market segments, indicating that they are not in a zero-sum competition. However, as technology continues to evolve, the overlap between the two will likely increase, intensifying competition in the future.
Disclaimer: The views and opinions expressed in this article are those of the original authors and do not necessarily reflect the official policy or position of MiniMicroLED Insights . While we strive to ensure the accuracy and reliability of the information provided, the content on this website may include translations, re-edited versions of second-hand information, or information derived from unverifiable sources. MiniMicroLED Insights makes no representations or warranties, express or implied, regarding the completeness, accuracy, or timeliness of such content. The information in this article is for informational purposes only and should not be construed as professional advice. Any reliance you place on such information is strictly at your own risk. To the fullest extent permitted by law, MiniMicroLED Insights disclaims all liability for any direct, indirect, incidental, consequential, or punitive damages arising out of your use of, or reliance on, the information contained in this article.
Copyright Notice: This article may include translated and re-edited content derived from various online sources, including websites and social media platforms. While we strive to credit the original authors and sources to the best of our ability, we may not always be able to verify the original source of the content. All rights to the original content remain with the original author or source publication. Where applicable, this content is reproduced for educational and informational purposes under the fair use doctrine. If you believe any content on this site infringes upon your intellectual property rights, or if you are the copyright owner and believe we have not credited you correctly, please contact us at minimicroled.business@gmail.com. We will investigate and take corrective action, including removing or properly crediting the content if necessary.
Content sourced and adapted by MiniMicroLED Insights (Doris).