Recent Announcement by Jingce Electronics
Recently, Jingce Electronics announced the successful mass delivery of its Seal series TGV testing equipment to a leading client in Central China’s TGV industry, marking an important breakthrough in semiconductor FOPLP (Fan-Out Panel-Level Packaging) advanced packaging testing.

Application of TGV Technology in Mini/Micro LED and Semiconductor Packaging
The client is utilizing Jingce Electronics’ proprietary TGV technology (Glass Through Via technology) for applications in Mini/Micro LED direct display, semiconductor advanced packaging substrates, and other precision devices.
What is TGV Technology?
TGV technology is a vertical electrical interconnection technique that passes through glass substrates. It works by creating tiny through-holes in the glass substrate, which are then filled with conductive materials to establish electrical connections.
Key Features of TGV Technology
- Excellent high-frequency electrical properties
- Easy access to large-size ultra-thin glass substrates
- Low cost and simple process flow
- Strong mechanical stability
These features make TGV technology suitable for applications in 2.5D/3D wafer-level packaging, MEMS sensors, CMOS image sensors, automotive RF, and camera modules.
TGV Technology in LED Displays
In the LED display field, Woge Optoelectronics, which focuses on core precision components in the optoelectronics and semiconductor industries, is not only dedicated to developing and applying the Mini LED glass-based COG (Chip-on-Glass) solution but also promoting the application of glass-based TGV technology in Micro LED direct display and semiconductor advanced packaging.
Precision Testing with Seal Series TGV Equipment
This time, Jingce Electronics provided its Seal series TGV testing equipment to the client. The equipment is mainly used for testing key process flows such as TGV through-holes, metal filling inside the holes, surface metallization, and RDL (Redistribution Layer) processes.
Detected Defects and Testing Capabilities
The defects detected include graphic anomalies, surface damage, foreign contaminants, shorts, opens, scratches, and residues. The equipment is optionally equipped with key dimension measurement and film thickness measurement modules. With high testing accuracy and excellent data processing capabilities, the equipment can precisely detect defects in microstructures and provide detailed reports to help clients improve production efficiency and product quality.
About Jingce Electronics
Jingce Electronics specializes in the R&D, production, and sales of testing systems for displays, semiconductors, and new energy sources. Currently, the company’s main products in the display field cover testing equipment for various display devices, including LCD, OLED, Mini LED, Micro OLED, and Micro LED, as well as electrical measurement and debugging systems, front-end process AOI (Automated Optical Inspection) equipment, and integrated automation products.


Impressive Financial Growth
In the first three quarters of this year, Jingce Electronics achieved a revenue of USD 250 million, a year-on-year increase of 18.50%. The net profit attributable to the parent company reached USD 11.2 million, a year-on-year growth of 752.58%.
Delivery of Micro LED CT AOI Testing Equipment
In terms of LED applications, in September of this year, Jingce Electronics also delivered its Micro LED CT AOI testing equipment to a provincial-level laboratory client.
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