On October 22, 2024, the National Intellectual Property Administration revealed that Jiangxi Yaochi Technology Co., Ltd. has applied for a patent titled “Mini-LED Chips and Their Fabrication Method,” with publication number CN118763158A, submitted on September 2024.
Patent Overview
The patent discloses a Mini-LED chip and its fabrication method, which pertains to the field of semiconductor optoelectronic devices. The fabrication process consists of several key steps:
- Providing the Epitaxial Wafer: The design of the epitaxial wafer forms the foundation of the Mini-LED chip. Precise control over the designated areas ensures the effectiveness of subsequent processes.
- Forming the Bonding Layer: Effective bonding between layers ensures the stability and reliability of the chip.
- Bonding with the Second Substrate: Identifying the optimal substrate connection method within a diverse array of material combinations is crucial.
- Forming the First Via: The angled design enhances the chip’s light efficiency, with the hole’s structure directly impacting the optical performance.
- Forming the First Contact Layer: This layer covers the bottom of the first via and the predetermined length of the sidewall, establishing ohmic contact only with the P-type semiconductor layer. Its design must ensure effective current transfer through ohmic contact while maintaining light uniformity.
- Forming the Second Contact Layer to Obtain an Intermediate Product: The added contact layer provides a more robust electrical connection for LED operation.
- Creating the DBR Layer on the Intermediate Product: This step involves etching to form the second and third vias in the areas where the first and second contact layers are located. This is crucial for optical reflection and significantly impacts light efficiency.
- Forming the N and P Electrodes to Produce the LED Wafer.
- Cutting the LED Wafer to Obtain Mini-LED Chips.
By implementing this invention, the light efficiency of Mini-LED chips can be enhanced. The successful execution of each step directly affects the quality of the final product. Through this series of meticulous processes, Jiangxi Yaochi’s Mini-LED chips will achieve higher light output, addressing the market’s urgent demand for high-quality displays.
Company Background
Established in 2019 and backed by SMTC Holdings, Jiangxi Yaochi focuses on the design, research, development, and production of semiconductor materials and devices, electronic materials, and lighting equipment. Jiangxi Yaochi Technology Co., Ltd. continuously delves into the realm of semiconductor optoelectronic devices, with its R&D capabilities and technological accumulation propelling the company to a higher level in the technology sector. The release of this patent showcases the company’s innovation capacity and represents a proactive response to future market demands.
Conclusion
Jiangxi Yaochi’s application for the “Mini-LED Chips and Their Fabrication Method” patent illustrates its proactive exploration in the field of innovation. This not only opens new directions for the company’s development but also brings fresh hope to the industry as a whole. As technology continues to advance, it is anticipated that Mini-LED technology will demonstrate its unique advantages across various fields, driving market transformation in display technology. Soon, we may witness stunning visuals brought forth by Jiangxi Yaochi on more devices. This improvement in chip technology will not only represent a technical innovation but also a firm confidence in revolutionizing future visual experiences.
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