On January 22, HGC (Wuhan) Technology Co., Ltd. launched the mass production of its “Optical-Driver Integrated Heterogeneous Integrated Light Source” HI-CSP, a technology that integrates the light source and driver IC into a single package. This eliminates the need for traditional large-size drivers and enables high-division Mini LED backlighting with reduced thickness, improved quality, cost reduction, and further decreased power consumption, thus expanding the advantages of Mini LED.
Optical-Driver Integration: Pixel Pitch Reduction and Backlight Slimming
Currently, Mini LED technology is developing rapidly, and companies are accelerating product iterations toward higher divisions, lower costs, and thinner designs.
HGC’s HI-CSP Optical-Driver Integrated Heterogeneous Integrated Light Source is based on the original NCSP chip-level packaging technology and adopts both 3D vertical and 2.5D horizontal integration structures. The small driver IC is integrated with the Mini LED into a single unit.
This form significantly reduces the physical size of pixel units, helping to reduce pixel pitch and slim down the backlight panel. It enables Mini LED backlight sources to achieve high-division and lightweight characteristics in end products.
Overall Solution Optimization: Cost Reduction and Efficiency Improvement
It is worth noting that HGC’s HI-CSP Optical-Driver Integrated Heterogeneous Integrated Light Source also optimizes the overall Mini LED backlight solution.
In conventional designs, separate drivers and light-emitting diodes are arranged on the same surface of the backlight board. This can result in dark spots due to the large size and black appearance of the driver. This issue becomes more pronounced in high-division products.
Therefore, high-division Mini LED typically places drivers on the back of the light-emitting diodes, which requires multi-layer PCBs. This increases material costs and decreases backlight compatibility, while also complicating module integration.
HGC’s HI-CSP eliminates large-size black drivers by utilizing optical-driver integrated technology. This improves the brightness uniformity of the backlight and allows the use of single-sided PCBs, balancing high-definition display requirements with cost-effectiveness.
Additionally, the HI-CSP Optical-Driver Integrated Heterogeneous Integrated Light Source transforms the traditional separate packaging of the light source and driver into a single integrated package.
This single-pass process reduces steps, enhances efficiency, and, along with the cost reduction in high-division backlight PCBs, achieves a 15-30% overall reduction in Mini LED backlight costs, accelerating its penetration into the ultra-high-definition market.
Successful Mass Production: Titan Army New Monitor
Currently, HGC’s HI-CSP series Heterogeneous Integrated Light Source has successfully entered mass production.
The upcoming flagship Titan Army eSports monitor features the HGC HI-CSP Mini-LED backlight source, with 2304 light control zones, enabling precise control of screen lighting and more even and delicate backlight brightness.
As the first IDM light source manufacturer in the world to focus on and successfully commercialize optical-driver integrated technology, HGC emphasizes the creation, utilization, and protection of intellectual property rights. The company is actively building a global IP layout.
Around core technologies like HI-CSP, HGC has filed dozens of patents related to light source chips, integrated packaging, and module applications. These include 4 international patents (PCT), 2 US patents, with patent protection covering multiple key regions including China, Europe, and the US.
Adhering to the philosophy of “open cooperation, mutual benefit, and win-win,” HGC is willing to share its innovative achievements with upstream and downstream partners. Enterprises or individuals interested in cooperation can contact HGC to obtain patent licenses and jointly promote the commercialization and market expansion of cutting-edge technologies.
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