In today’s rapidly evolving display technology landscape, Mini LED direct display technology has successfully filled the gap in the ultra-large product market with its unique advantages of mobility and limitless size splicing, becoming a key technology for major display manufacturers to develop.
Packaging Methods for Mini LED Direct Display Technology
Mini LED direct display technology mainly employs three packaging methods: COB (Chip-on-Board), IMD (Integrated Matrix Devices), and MiP (Micro-in-Package). In recent years, COB packaging products have surged in popularity within the small-pitch LED market due to their high integration, excellent protection, and surface light source-like visual effects. According to DISCIEN data, in the first quarter of 2024, domestic sales of small-pitch LED terminals reached $590 million, a year-on-year increase of nearly 10%. Notably, the COB terminal market saw sales reach $138 million, representing over 115% growth. With continuous capacity expansion and the influx of new companies, competition in the COB market is intensifying, gradually shifting from high-end to mid-range positioning, showcasing a strong momentum to capture other small-pitch LED markets. This institution also predicts that by 2028, the COB market share will exceed 40%, with sales expected to surpass $2.5 billion.

HKC‘s Strategic Moves in the Mini LED Market
As a leading player in the display industry, HKC MLED Technology Innovation Drives Display Industry Upgrade has actively positioned itself in the Mini LED market, successfully establishing its first large-size COB display production line. Currently, HKC’s COB capacity is increasing each quarter and is projected to reach 120K units by the end of 2024. HKC’s COB products, backed by superior technical advantages and product quality, have gained widespread recognition in the market. The products primarily use flip-chip technology, which offers significant advantages such as high stability, long lifespan, large luminous area, high luminous efficiency, and exceptional display quality. Additionally, advanced technologies like high blackening treatment, unique pad design, and full gray-scale calibration further enhance the display effects and performance of the products.

The Future of COB Technology
Moreover, flip-chip technology is currently the only packaging method capable of achieving smaller chips and smaller pixel pitches, making it a vital pathway for realizing Micro LED technology in the future.
Given that COB LED products are constructed from multiple small modules, they are not limited by size, making them highly suitable for ultra-large screen applications in command centers, security monitoring, advertising media, banking, exhibitions, and large screen rentals.
Successful Market Applications
Currently, HKC’s COB LED products have achieved mass delivery and generated value across numerous application areas. For instance, at the ISVE Smart Display Expo, HKC showcased a COB 4K ultra-large screen measuring 7840 x 3375 mm. This screen, with its vibrant colors, high brightness, and high contrast images, attracted many spectators.

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