Overview of the Patent
Recently, Shanxi GKGD Electronic Group Co., Ltd. announced that its patent for “a Method for Fabricating Micro MIP Devices” has entered the public review stage.
Patent Details
This invention discloses a method for fabricating Micro MIP devices, which includes the following steps:
S1. Bonding a COW (Chip on Wafer) containing LED chips with a temporary carrier plate and performing laser delamination;
S2. Conducting mass transfer of tricolor chips, arranging and transferring the chips in a matrix pattern onto the same carrier plate;
S3. Preparing a piece of tempered glass and applying glue on one side;
S4. Depositing metal traces and metal pads on the surface of the tempered glass in a matrix arrangement;
S5. Welding the chip carrier plate to the prepared circuitry on the tempered glass using mass soldering technology;
S6. Delaminating the chip from its carrier plate using laser technology;
S7. Packaging the structures on the tempered glass;
S8. Cutting the Micro MIP devices using a hidden cutting method.

Technological Advancements
The fabrication technology of this invention allows for the production of Micro MIP devices necessary for Micro LED displays, addressing challenges related to long manufacturing cycles and the difficulty of achieving fully automated mass production. This fabrication method is both simple and efficient.
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