Introduction
On June 19, the launch ceremony for the EPS Jiangmen base, with a total investment of $50 million, was grandly held in the Changjiang Industrial Park of Taoyuan Town, Heshan City, Guangdong Province. At 6:18 PM, the successful production of the first BT substrate marked a significant milestone for the company.
Significance of the New Facility
He Yufang, General Manager of EPS, stated that this marks a turning point in the industrial upgrade of EPS and signifies the beginning of a rapid development phase.
Project Details
The EPS Jiangmen base has a total investment of $50 million, focusing on MIP and COB BT substrates, black films for Mini & Micro LED, IC packaging BT substrates, and ABF-like films. Once fully operational, it is expected to achieve an annual production capacity of 3 million square meters of BT substrates and 1 million square meters of ABF-like films (including COB black films).
Future Expansion Plans
To meet future market demands, EPS plans to expand its production capacity by 9 million square meters of substrates and 3 million square meters of ABF-like films (including COB black films) by 2026.
Company Background
Founded in 2015, EPS has established its headquarters and R&D center in Guangzhou, along with BT substrate and laminating film production bases in Jiangmen. To date, EPS has accumulated rich experience in R&D and production in the fields of BT substrates and laminating films, providing advanced semiconductor substrates and solutions for IC packaging and the Mini & Micro LED display industry.
Innovations for the Mini & Micro LED Market
For the Mini & Micro LED market, EPS has introduced black high Tg copper-clad laminates, specifically EPS-825D and EPS-829G. The EPS-829G, designed for Mini COB applications, has gained market favor due to its low warpage, high modulus, excellent ink consistency, and absence of bright edges or lines.
Meeting Micro LED Display Demands
As the demand for Micro LED displays grows, PCBs are also gradually decreasing in size, with lower warpage and thermal expansion rates and higher precision. This has resulted in higher material requirements: low expansion coefficients, high modulus, and low copper foil roughness.
Cost-Effective Breakthroughs in Mini RGB Display Market
Simultaneously, EPS is continuously exploring new breakthroughs for cost reduction and efficiency in the Mini RGB display market. For example, in the competitive landscape of P1.25 displays, the Chip RGB’s breakthrough relies on a gold-free surface treatment process to lower costs. The silver board combined with ALD technology ensures reliability against ion migration for over 30 days, while optimizing costs compared to gold boards without sacrificing quality.
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