Suzhou Qiushui Semiconductor Technology Co., Ltd. was established in November 2022, focusing on the damage-free Micro-LED chip technology pioneered by its founder. By integrating advanced 8-inch semiconductor hybrid bonding processes, the company addresses core issues in Micro-LED technology across five dimensions: light, electricity, heat, force, and stability. This innovative approach fundamentally resolves challenges such as material damage, low optical efficiency, poor yield rates, and difficulties in colorization, thereby providing unique Micro-LED chip products for global customers.

Launch Announcement
According to a news update from Qiushui Semiconductor on October 22, the company has globally launched the world’s first damage-free Micro-LED chip, which effectively addresses efficiency issues caused by etching damage in red Micro-LED chips. The company’s damage-free technology route has successfully validated its Micro-LED products and is now entering the sample delivery phase for clients.
Pioneering Technology
Official information reveals that Suzhou Qiushui Semiconductor Technology Co., Ltd. integrates a pioneering damage-free Micro-LED chip technology with an advanced 8-inch hybrid bonding process. This unique method connects the micro and macro dimensions, fundamentally tackling significant challenges in Micro-LED technology, including high material damage, low optical efficiency, low manufacturing yield, and colorization issues.
Challenges in Micro-LED Technology
Among the many challenges facing Micro-LED technology, the most pressing is the material damage caused by etching during the pixelation process, which severely affects chip efficiency and introduces stability issues such as stress release, leakage, and ESD. These challenges have hindered the mass production of high-efficiency, high-yield, and low-cost Micro-LED chips.
Innovative Solutions
Qiushui Semiconductor’s damage-free technology route innovatively employs an electrically insulated structure, replacing traditional physical insulation methods. This advancement achieves electrical isolation of each pixel without any material damage. Because the light-emitting layer is free from etching damage, this represents the optimal technological pathway to solve the material damage problem in Micro-LEDs. This breakthrough addresses the lifespan issues of high-power digital automotive lighting chips in high-temperature environments and overcomes efficiency problems in red Micro-LED chips due to etching damage. Thus, Qiushui’s advancements will undoubtedly accelerate the mass production process of Micro-LED chips.
Visual Illustrations
The accompanying images illustrate the product structure based on this technology: the left image shows the light-emitting layer without any etching damage, while the middle image features a digitally designed automotive lighting chip module by Qiushui. The right image displays the product’s appearance with a complete flat pixel area (top right) and a demonstration of full-screen illumination with blue monochrome (bottom right).

Performance Comparison
A comparison between the structure of Qiushui’s damage-free Micro-LED chips and traditional chips with material damage reveals superior performance: intact light-emitting materials, preserved efficiency, high stability, and no leakage. This damage-free technical solution simultaneously incorporates advanced 8-inch wafer-level hybrid bonding processes, enabling high-resolution, high-yield, and low-cost mass production of Micro-LED chips, empowering the entire Micro-LED industry.

Team Expertise
Additionally, Qiushui Semiconductor’s official materials indicate that its core technical team is one of the pioneers in China’s hybrid bonding technology, possessing mature mass production process experience and having developed hybrid bonding processes with a minimum pitch of 0.7 microns.
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