On December 26, China Construction First Building (Group) Corporation Limited (CSCEC) announced that the Section A of the 6th-generation new semiconductor display device production line project undertaken by CSCEC for BOE Technology Group Co., Ltd. has recently passed the completion acceptance check.
Project Overview
The 6th-generation new semiconductor display device production line project by BOE covers a total construction area of approximately 607,000 square meters. The building area of Section A is about 531,000 square meters. The project’s total investment is ¥29 billion (approximately $4 billion), with advanced semiconductor display technologies such as LTPS and LTPO being utilized. The primary products will include VR display panels, Mini LED direct view backplanes, and other high-end display products, with a glass substrate size of 1500mm × 1850mm. The design production capacity is 50,000 sheets per month. According to Qichacha, the project is managed by BOE Chuangyuan Technology Co., Ltd., a subsidiary of BOE Technology Group Co., Ltd., which holds 79.31% of the shares, with the remaining 20.69% held by Beijing Yitang Zhixian Industrial Investment Management Center (Limited Partnership).
According to industry sources, the 6th-generation new semiconductor display device production line project began construction in 2023 and is expected to start production in early 2025, with full capacity expected by 2026. The project timeline is as follows:
- February 2023: Construction commenced in Beijing Economic Development Zone.
- December 2023: Project topping-off.
- August 2024: Production line move-in ceremony.
- December 2024: Section A passed completion acceptance.
About BOE
BOE Technology Group Co., Ltd., a global leader in the semiconductor display field, operates multiple intelligent manufacturing bases across Beijing, Hefei, Chengdu, Chongqing, Fuzhou, Mianyang, Wuhan, Kunming, and Ordos. The company has established a “1+4+N+Ecosystem” development framework, with its core semiconductor display business driving growth in sensing, IoT innovation, MLED business, and smart medical engineering.
In 2024, BOE achieved significant progress and milestones in the MLED field.
Technological Advancements
In recent years, BOE has strategically positioned itself in emerging fields such as glass-based packaging and perovskite photovoltaic devices. In the field of glass-based packaging, the company has established an experimental line and set up an advanced packaging project team, successfully producing prototype models.
Product Developments
In 2024, BenQ launched its first glass-based active Mini LED display featuring a 31.5-inch display panel from BOE. In the automotive sector, BOE introduced its first P0.3 Micro LED in-vehicle display product, and its 13.48-inch Mini LED backlight display panel was installed in Hongqi’s Guoya series vehicles.
Progress on LED Projects in 2024
Several BOE subsidiaries have seen advancements in their LED projects in 2024, as detailed below:
- December: Zhuhai BOE MLED Technology held an equipment move-in ceremony for the Mini/Micro LED COB display product expansion project.
- November: BOE HC SemiTek Micro LED wafer manufacturing and packaging testing base project began production.
- June: BOE and Chery signed a joint innovation display lab agreement to accelerate the development of new automotive display technologies and integrated display solutions.
- May: The first equipment was moved into the BOE HC SemiTek Micro LED wafer manufacturing and packaging testing base project.
- January: The BOE HC SemiTek Zhuhai Micro LED wafer manufacturing and packaging testing base project topped out.
Looking Ahead to 2025
At the “Towards New 2025” Year-End Media Summit, BOE announced its plan for the next phase of development. The company will focus on breakthroughs in six key areas: strategy, technology, applications, ecosystem, business models, and ESG (Environmental, Social, and Governance).
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