While Mini LED COB packaging has advantages in display performance, reliability, and stability, as a new technology, it faces challenges such as high production line setup costs and lengthy testing times. These issues have become barriers that must be overcome for the large-scale production of Mini LED COB packaging. Asmade Zhuoxing Semiconductor offers the latest solutions to address these challenges.
Trends in the Mini LED COB Direct Display Market
Mini LED Direct Display products have developed over several years, with the technological roadmap now largely defined. The industry is currently moving towards larger substrates, smaller pixel pitches, and steadily decreasing prices, intensifying competition.
Regarding production capacity, as of October 2024, the production capacity for Mini LED COB direct display equipment is approximately 70,000 m²/month (based on P1.25). The actual shipments are around 40,000 m²/month, a threefold increase compared to the average of 10,000 m²/month in 2023. By 2028, the annual production capacity is expected to reach 500,000 m².
On the product side, there are currently three major mainstream module series: the 600×337.5mm series, the 500×500mm series, and other module specifications. Among them, the 600×337.5mm series features 8- and 4- panel configurations. From both a cost and production efficiency perspective, it is anticipated that the entire industry will transition to the 4-panel method by next year, with the possibility of a 200×337.5mm vertical screen configuration using three panels in the future.
As for pixel pitch, the pitch for Mini LED COB products has steadily decreased from P1.5 to P1.2, P0.9, P0.7, and now to P0.6. Future efforts may focus on P1.5 and P0.7.
As the chip scale effect becomes more pronounced and manufacturing costs decrease with the maturation of the technology, the price of Mini LED COB has been steadily decreasing year by year, from 48,000 RMB/m² in 2018 (based on P1.25) to 9,000 RMB/m² in 2024, with projections for the price to drop further to 8,000 RMB/m² by next year.
New Standards for the Mini LED COB Direct Display Production Line
As competition intensifies, the standardization and scaling of Mini LED packaging production lines have become inevitable trends. Large-scale manufacturing requires ecosystem support from the entire industrial chain. The current manufacturing model is markedly different from the past, requiring more integration of industrial resources. Instead of simply purchasing individual pieces of equipment to assemble a production line, companies now expect equipment manufacturers to provide more reasonable solutions, acting as “turnkey” service providers. These solutions encompass factory planning, equipment configuration, and optimized process design, all of which are crucial for enhancing product competitiveness.
The new standard for Mini LED COB direct display production lines means higher output per unit area, the ability to accommodate large substrates, lower depreciation costs, high process compatibility, and advanced automation. This standard will lead the Mini LED COB direct display sub-industry into a new era of low-cost, high-efficiency operations.
Asmade Standardized Production Line Solutions
Asmade, addressing the challenges of standardization and scalability in the Mini LED COB application, offers patented technologies like the industry-first Pixel Die Bonder, intelligent MES systems, and online scheduling systems to empower standardized intelligent production lines. These innovations meet the growing demand for standardization and scalability in Mini LED packaging.
In the area of die bonding, Asmade has developed a Pixel Die Bonder capable of bonding three colors simultaneously, with a UPH of 75K, the highest level in the industry. Additionally, the Pixel Die Bonder allows for mixed bonding without slowing down the process, supporting large substrate production needs. It accommodates all common module sizes on the market and considers future product size development trends over the next three to five years.
Traditional die bonders bond one color at a time, requiring multiple workstations to complete an RGB die bonding process. The Pixel Die Bonder, on the other hand, bonds a full pixel in a single workstation, eliminating the need for secondary transfers. This streamlined process increases efficiency and reduces the risk of defects.
If die bonding efficiency is insufficient and chips are not bonded within the proper paste control time, it can lead to extensive defects, compromising production efficiency. Asmade is focused on improving die bonding efficiency, to reach a 90K UPH in the future. The Pixel Die Bonder uses three arms to work simultaneously, ensuring high yield, efficiency, and stability.
In response to the demand for large-scale Mini LED COB manufacturing, Asmade has designed a compact, ultra-intensive parallel production line capable of linking 2 to 60 die bonders. This narrow production line, only 670mm wide, allows for high-density equipment placement and maximizes output within limited space. With a standard 9m workshop, two large lines can be deployed, significantly increasing capacity.
Furthermore, the parallel production line ensures that each machine operates independently. Even if one machine fails, it will not affect the others, ensuring high operational efficiency. This configuration offers the same operational rate whether linked to one or 60 machines, ensuring minimal differences between theoretical and actual production capacity. The parallel design allows for multi-machine, multi-product production, providing flexibility to meet various production needs.
Asmade‘s intelligent systems, such as the Mini LED COB specialized production dashboard and remote monitoring systems, track production data, including CPK statistics for printing sections, die bonder status, average production time, throughput rates, yield, and defect rates. These tools provide essential support to clients before implementing ERP systems, helping streamline operations, shorten project timelines, and reduce costs.
From the perspective of standardized intelligent production lines, Asmade‘s Mini LED direct display packaging line can accommodate up to 60 die bonders, featuring a vast bonding range and meeting the needs for large substrates. The line’s monthly capacity reaches 1,200 m² (based on P1.25). Precision and yield are enhanced by AI-based closed-loop process management, with automated substrate flow, multi-machine mixed bonding, defect traceability, yield self-correction, and MES network communication.
Overall, Asmade‘s standardized intelligent production lines offer numerous advantages, including a higher number of parallel machines, faster line setup, superior smart process services, greater product compatibility, and larger per capita output. These benefits will drive the large-scale production and application of Mini LED COB direct display technology.
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