As a leading equipment manufacturer for MLED, ASMPT‘s devices have been adopted in various Mini/Micro LED production lines. This article delves into ASMPT’s market strategies, shedding light on their perspectives and plans for the LED industry, particularly in the COB and Micro LED sectors.
COB Capacity Soars: ASMPT’s Strategic Response in the LED Industry
Q: According to a report by Industry Expert Research, as of mid-July, COB production capacity (calculated based on P1.2) reached 36,000 square meters per month. How has this growth in COB technology demand affected enterprise output and capacity expansion? From an equipment perspective, how is ASMPT positioning itself in this growing market for LED technology?
ASMPT: This year, the COB sector continues the growth momentum from last year, especially in the P1.2 or smaller pixel pitch market, where COB solutions have been widely adopted.
From ASMPT’s standpoint, the rapid expansion of COB not only presents new opportunities but also drives advancements in equipment development. Regardless of the technology route, ASMPT’s current product lines can meet the evolving market demands.
Currently, our flagship product, Vortex, remains highly competitive and continues to satisfy market needs. With our extensive expertise in die-bonding technology, Vortex meets the industry’s precision and quality requirements and is future-proof for upcoming developments, such as glass-based products.
In addressing challenges like miniaturization of chips and color uniformity—especially for high-end products with ultra-small pixel pitches (P0.4)—the VORTEX II-Plus, with its 2×4 chip processing capability and ability to handle up to 54 wafers, is designed to meet the most demanding product requirements.
The VORTEX II-Plus also boasts advanced features like XYθ zero-delay automatic calibration, ±10 μm @ 3σ XY positioning accuracy, and ±1° @ 3σ wafer rotation precision. Its high-speed and high-yield production capabilities are further enhanced by integrating with InLine Linker for automated production. These advantages make the VORTEX II-Plus and VORTEX XL powerful contenders in the Mini LED production space, fully meeting market demands for LED displays.
Micro LED Mass Production Progress Hinges on Cost
Q: Recently, Industry Expert released a white paper on film and Micro LED technology, emphasizing the application of Micro LED TVs for home cinema setups. From an equipment manufacturer’s perspective, is Micro LED technology evolving quickly enough to meet the demands of home-use scenarios? Are there any other noteworthy applications, such as MiP (Micro LED in Package), that could accelerate the commercialization of Micro LED?
ASMPT: Several companies have made significant progress in achieving high pixel density for Micro LED, and there are already plans for mass production. ASMPT is collaborating with a Korean brand to launch products aimed at the home television market, continuously optimizing the processes. A new series of home TV products is expected to launch this year.
However, cost remains the primary hurdle. With Micro LED displays costing over $10,000 per square meter, they are significantly more expensive than other display technologies.
In response to this, the European and North American markets are exploring a rental model for home applications, where customers can lease display units on a monthly or yearly basis. This model offers a more affordable entry point and mitigates the financial risk of potential damage to high-cost products. This rental approach is currently seen as a way to gradually stimulate market demand.
On a smaller scale, transparent Micro LED screens have garnered attention this year, with a transparency rate of approximately 60%. However, the high cost, currently around $30,000, means that further cost optimization and expanded use cases are necessary for broader market penetration.
In summary, the primary competitive edge of Micro LED still lies in cost reduction. Unlike small screens, home cinema displays do not require extremely high pixel densities but have larger dimensions, which demand higher transfer efficiency and precision. Ultimately, the key to future competition will be the rate at which costs can be reduced.
For Micro LED technology, ASMPT’s focus is on the AD300Pro mass soldering equipment. After LED chips are placed on a substrate with pre-printed solder paste, traditional reflow soldering methods can push the solder paste up and misalign the chips. This results in tilted chips and potential bright spot issues when the LED module is illuminated.
The AD300Pro controls the chip tilt within 1μm, eliminating bright spots. The AD300Pro follows these core process steps:
- VORTEX II-Plus picks multiple LED chips and places them on a temporary carrier board.
- The carrier board, containing multiple LED chips, is aligned with the solder points on the display substrate.
- LED chips from the carrier board contact the solder points on the display substrate.
- The bonding head applies pressure to the conductive material while heating the LED chips.
- An electrical connection is formed between the LED chips and the display substrate.
The VORTEX II-Plus and AD300Pro equipment can be adapted for a variety of scenarios, including COB and MiP technologies.
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