Recently, the Guangdong Provincial Association of High-tech Enterprises announced the list of the 2024 Guangdong Province High-tech Products of Excellence, and ASMADE’s Mini LED pixel die bond machine was selected through a rigorous evaluation process. This recognition highlights the company’s advanced technology and market strength, affirming its position as a leader in the industry.
Evaluation Criteria for Guangdong’s High-tech Products of Excellence
The evaluation of the Guangdong Province High-tech Products of Excellence is based on five key factors: technological level, intellectual property, market influence, environmental performance, and product honors. ASMADE’s Mini LED pixel die bond machine was recognized for its outstanding performance across all these aspects, underscoring ASMADE’s robust technological strength and market competitiveness.
Innovative Patent Breakthrough: The Pixel Die Bonding Technology
What is pixel die bonding? It refers to the process of completing the bonding of RGB chips simultaneously based on precise pixel positioning in one step—a groundbreaking innovation often referred to as the “One-shot Three Bonding” method. ASMADE pioneered the pixel die bonding technology in the industry, breaking away from the traditional Mini LED wafer placement method and enabling single-machine, single-product bonding.
The Mini LED pixel die bond machine adopts a parallel wiring production technology, combining an advanced pixel die bonding process with a rear-entry, rear-exit wiring layout. The machine features a unique motion control mode, reducing the substrate travel distance by 60%, while ensuring no speed reduction during mixed bonding, significantly improving speed, accuracy, and yield. This technology can perfectly accommodate direct display substrates up to 270mm x 520mm in size, with a UPH (Units Per Hour) rate of up to 75K/H.
About ASMADE
Shenzhen ASMADE Semiconductor Technology Co., Ltd. is a national high-tech enterprise and a national-level “Little Giant” enterprise focused on high-precision semiconductor equipment development, manufacturing, and sales. ASMADE is committed to providing customers with one-stop semiconductor packaging and wafer placement solutions. The company’s main products include advanced packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control systems, and semiconductor packaging process management systems.
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