I. Micro LED Wafer-Level PL Mass Inspection Equipment
Product Introduction
This equipment is used for the wafer-level mass inspection of Micro LED chips, monitoring their luminous performance and improving yield by providing sorting criteria for the binning process. As the size of LED chips continues to shrink, the number of chips on a single wafer can reach millions or even tens of millions, requiring optical performance testing for each individual LED chip. We use microscopic photoluminescence imaging, confocal differential interference imaging, and high-resolution dark-field imaging to achieve non-contact, non-destructive, and ultra-fast defect/subsurface defect detection on transparent samples, significantly improving production efficiency and yield, reducing production costs, and accelerating industrial development.
- High-efficiency, high-precision mass spectral collection technology: Achieving synchronous detection of massive targets by using high spatial resolution light intensity spectral collection methods, simultaneously collecting light intensity and spectral signals to improve detection efficiency.
- Micro-LED photoluminescence uniform excitation technology: Utilizing a special optical illumination system to avoid emission anomalies caused by excitation light differences, ensuring uniform light source excitation for consistent photoluminescence intensity testing.
- Defect Micro-LED photoluminescence characteristics big data model: Analyzing light intensity and spectral types to create a database of abnormal chips. The study focuses on diagnostic methods for Micro-LED defects and anomalies based on spectral parameters, enabling efficient and accurate anomaly detection based on spatial, light intensity, and spectral parameters to meet the inspection needs of the Micro LED industry.
Application Fields:
- Defect inspection for COW/COC1/COC2 MicroLED wafers.
- Defect detection for 4″ and 6″ EPI wafers.
Product Advantages:
- Ultra-high-speed, non-destructive inspection.
- Excellent reproducibility and stability.
- Sub-micron resolution.
Typical Inspection Results:
Same location MicroLED chip PL vs AOI:
Right: AOI images show normal
Luminescence Brightness Distribution:
(e.g., the wafer above shows a region with many dark spots)
Luminescence Wavelength Distribution:
(e.g., the wafer above can be divided into three regions with a 2.5nm wavelength)
II. Micro LED Wafer-Level High-Throughput AOI Inspection Equipment
Product Introduction
This equipment is used for surface defect inspection and position measurement of Micro LED chips, providing data support for transfer and repair processes and monitoring chip yield. We employ high-precision microscopic imaging technology and advanced algorithms to achieve sub-micron level defect detection and accurate position measurement, ensuring product consistency by identifying minute defects while providing precise data support for high-quality production and yield improvement.
- Accurate measurement of chip displacement (X/Y) and deflection (Theta) without a reference (±1.0μm). System-level error corrections in hardware and algorithms eliminate issues such as motion axis linearity deviation, X-Y perpendicularity deviation, optical imaging distortion, and image feature edge recognition deviation, achieving the required precision.
- Ultra-high throughput detection speed with tact time < 30s (or > 120 UPH). Equipped with a large-field optical imaging system and ultra-fast autofocus system, paired with high-resolution TDI line scan cameras, this system enables rapid image acquisition. Advanced image processing algorithms perform real-time calculations and analysis to detect defects quickly.
Product Advantages:
- Large field of view with ultra-high-speed detection.
- Powerful data processing capabilities.
- Sub-micron resolution.
Typical Inspection Results:
Defect Classification Wafermap:
Typical Micro LED anomalies:
Shift (offset)
Rotation (deflection)
Missing
Abnormal appearance (dirt, etc.)
Defect Classification Wafermap:
Defect Wafermap:
normal, glitch, dirty, missing, damaged, etc.
Position Measurement Wafermap:
Offset Wafermap.
About Alphabetter
Founded in 2020 in the Bao’an District of Shenzhen, Alphabetter has since established branches in Shanghai and Xiamen, with a modern R&D and manufacturing base spanning nearly 5000㎡. The core team consists of top-tier talent from renowned universities and semiconductor equipment companies, with nearly 70% of the staff being professional R&D personnel. Since its establishment, the company has received multiple rounds of funding from well-known institutions and has earned numerous honors, including High-Tech Enterprise and Specialized and Innovative accolades. Alphabetter adheres to the principles of material analysis and spectral optical technology, aiming to enhance the process control and yield management of compound semiconductor substrates, epitaxy, and chips. The company provides quantitative, standardized, and intelligent inspection tools for emerging fields like Mini/Micro LED new displays and SiC power devices, contributing to the rapid development of these advanced applications and helping China’s semiconductor equipment industry achieve global leadership.
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