Recently, several companies, including SMTC, Nationstar, HKC, ChangHong, RaySolve, and LIGHT CHIP, have publicly released their latest Micro LED-related patents. These patents cover key technological areas such as epitaxy, packaging, display screens, and test circuits.
SMTC recently announced two Micro LED-related patents:
The patent for a “Micro LED packaging method” is currently under substantive examination. This patent addresses the issue where, due to thermal expansion and contraction during Micro LED packaging, the LED chips may not remain on the same plane. As a result, the emitted light fails to meet the expected output, leading to inactive pixels and reducing product yield.
Another patent titled “Micro LED epitaxial wafer and its preparation method, LED chip” has entered the authorization stage. This invention uses AlNbN as the first buffer sublayer material, which significantly reduces lattice mismatch and improves the transitional buffering effect. This reduces dislocation caused by lattice mismatch, thereby enhancing the crystal quality of the epitaxial layer.
Additionally, AlONbN, which has very low internal stress, is used as the second buffer sublayer. This helps adjust the warping of the epitaxial layer and solves the issue of a lack of Micro LED epitaxial wafers with low dislocation density, high crystal quality, and high luminous efficiency in existing technology.
On May 17th, Nationstar published an invention patent titled “Integrated 3D Micro LED and its fabrication method,” which has entered the substantive examination phase.
The patent discloses an integrated 3D Micro LED and its fabrication method. The Micro LED includes a conductive substrate, a blocking layer, an epitaxial layer, a transparent conductive layer, a protective layer, a shielding layer, a first electrode, and a second electrode.
The invention forms several small-area epitaxial layers of Micro LEDs on a patterned conductive substrate. By leveraging the up-down electrical conductivity of the substrate, it eliminates the need for laser substrate removal. The transparent conductive layer connects multiple epitaxial layers in a conductive array, and along with the first and second electrodes, achieves Micro LED integration, addressing the challenge of mass transfer.
HKC unveiled a patent for a “Driving substrate, Micro LED transfer device, and transfer method.”
The patent introduces a driving substrate and a method for transferring Micro LEDs onto it. A bonding metal layer is placed on one side of the driving substrate, with a positioning layer around the bonding metal layer. The width of the positioning layer at a distance from the driving substrate is narrower than at its proximity. This structure resolves the issue of positional deviation during the transfer of Micro LEDs to the driving substrate.
ChangHong has disclosed three Micro LED patents:
One patent, “Heat dissipation structure for Micro LED projectors,” reveals a cooling mechanism for Micro LEDs, using a combination of TEC and heat pipe radiators to manage temperature rise in Micro LEDs effectively.
Another patent titled “Mini/Micro LED display screen” has entered the authorization stage. This utility patent enhances the stability of the display screen body and simplifies maintenance, improving the repair efficiency for the display body.
A third patent, “Micro-QLED color projection optical engine and its preparation method based on nano barrier technique,” is still in the publication stage. The patent describes a design using a nano barrier layer within the quantum dot emission layer, which reduces color crosstalk between different colored pixels, increases brightness and resolution for pixels emitting from a single side, and ultimately achieves high color purity in images.
RaySolve unveiled a patent titled “Micro LED microdisplay chip and its manufacturing method.” This patent describes a Micro LED microdisplay chip, which includes a driver panel, multiple LED units arranged one-to-one with corresponding LED platforms, each driven independently by the driver panel.
A fence structure with several grid holes surrounds each LED platform, creating recessed areas. A wavelength conversion layer, composed of first wavelength conversion units, fills these recessed areas, converting the first wavelength emitted by the LED units into a second wavelength.
LIGHT CHIP disclosed two Micro LED invention patents:
The first patent, “Display system based on Micro LED display panel,” pertains to projection display technology. It includes a Micro LED display panel, microlens array, and imaging optical system. The invention uses tilted optical axes of different microlens units in the array to enhance the brightness of the peripheral areas of the image light field, solving the dark corner issue in existing technologies.
The second patent, “Test circuit for active drive array in Micro LED display panel,” relates to integrated circuit technology. By incorporating a test circuit for the active drive array during the intermediate manufacturing stage, this invention enables yield detection of the active drive array, improving production efficiency.
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