Micro LED technology, celebrated for its exceptional performance, is widely regarded as the next-generation display technology. In theory, it surpasses today’s mainstream semiconductor display technologies in terms of brightness, response speed, color saturation, and contrast. However, unlocking its full potential requires more advanced driving technologies.
MicroWin‘s Groundbreaking Achievements
According to recent updates from MicroWin, the company has successfully integrated micro IC with micro LED in a hetero-structure configuration, and by the end of 2025, it is set to achieve a monthly production capacity of 2500kk for MIP and 500kk for D-MIP.
Challenges in AR Applications
For AR applications, micro LED near-eye displays, which feature a high pixel density (PPI > 3000), can only be driven by Si-CMOS backplanes. For larger displays with lower pixel densities (PPI < 600), however, 12-inch Si-CMOS backplanes become prohibitively expensive. This has led to the development of thin-film transistor (TFT) technology on large glass substrates (G10.5, approximately 10m²). TFTs made using LTPS (Low-Temperature Polycrystalline Silicon) or IGZO (Indium Gallium Zinc Oxide) technologies have lower electron mobility, presenting new challenges in driving micro LED light-emitting chips.

The Rise of Micro ICs Based on Si-CMOS
In response to these challenges, a new paradigm has emerged in the micro LED industry—micro ICs based on Si-CMOS technology. Through mass transfer technology, micro LED chips and micro ICs are simultaneously transferred to the target substrate, with CMOS devices—made from single-crystal silicon—delivering superior performance in driving micro LED chips compared to traditional TFT devices.

MicroWin‘s Groundbreaking MIP Chip Development
In February 2024, MicroWin developed its first micro IC under 100 micrometers and, combining years of expertise in mass transfer and advanced packaging, successfully achieved the integration of micro ICs and micro LED.
The newly developed driver-integrated MIP chips have upgraded MIP from a passive to an active device, breaking the previous limitation of LED displays, which were confined to commercial and professional applications. This innovation opens up new possibilities for micro LED in consumer markets.

Company Overview: MicroWin INC
Founded in 2020, MicroWin has established a pilot line in Kunshan for micro LED chip design, mass transfer, and advanced packaging. The company’s MIP chips have passed preliminary validation from some of the world’s largest semiconductor display manufacturers and are being showcased at events such as SID in the U.S. and IPC in Beijing. MicroWin has developed several MIP series based on fan-out packaging, including 03MIP, 02MIP, and 015MIP, and is offering customized solutions to meet the needs of various customer segments. By the end of 2025, MicroWin plans to achieve a monthly production capacity of 2500kk for MIP and 500kk for D-MIP.
MicroWin, based in Shenzhen, was founded in July 2020 and is an innovative technology company focused on the design and development of micro LED chips, mass transfer solutions, and product development. The company is dedicated to advancing core technologies and product solutions in the next-generation micro LED display industry.

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